scholarly journals Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

2020 ◽  
Vol 115 ◽  
pp. 113976
Author(s):  
Gautier Girard ◽  
Marion Martiny ◽  
Sébastien Mercier
Keyword(s):  
Printed Circuit Boards ◽  
Low Cycle Fatigue ◽  
Copper Film ◽  
Experimental Characterization ◽  
Cycle Fatigue ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
Annealed Copper

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

2009 ◽  
Vol 85 (6) ◽  
pp. 341-350 ◽  
Author(s):  
Jong-Bum Lee ◽  
Ja-Myeong Koo ◽  
Jong-Woong Kim ◽  
Bo-In Noh ◽  
Jong-Gun Lee ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Ultrasonic Bonding ◽  
Conductive Film ◽  
Flexible Printed Circuit

Mechanical Test of FPCB and Failure Analysis by Simulation

2009 ◽  
Author(s):  
Jian Zhong ◽  
Ping Yang ◽  
Jian-ping Li ◽  
Hai-bo Sun ◽  
Quayle Chen ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Boards ◽  
Simulation Analysis ◽  
Mechanical Test ◽  
Mechanical Tests ◽  
Stress Distributions ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Depth Analysis ◽  
Flexible Printed Circuit

The paper mainly presented mechanical test and failure analysis methods to reliability study of a new FPCB (Flexible Printed Circuit Boards). Mechanical tests include flexural test, tensile test and flexural fatigue and ductility test. As to simulation analysis, the stress distributions of FPCB under bending and tensile conditions were gained by simulations. Through in-depth analysis of the testing results, the mechanical reliability of FPCB was known detailed. The research provides an approach to improve FPCB performance.

Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

2008 ◽  
Vol 47 (5) ◽  
pp. 4300-4304 ◽  
Author(s):  
Jong-Bum Lee ◽  
Ja-Myeong Koo ◽  
Soon-Min Hong ◽  
Hyoyoung Shin ◽  
Young-jun Moon ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Ultrasonic Bonding ◽  
Flexible Printed Circuit

Modular Printed Circuit Boards for Broadband Characterization of Nanoelectronic Quantum Devices

2016 ◽  
Vol 65 (8) ◽  
pp. 1827-1835 ◽  
Author(s):  
Marco Lorenzo Valerio Tagliaferri ◽  
Alessandro Crippa ◽  
Simone Cocco ◽  
Marco De Michielis ◽  
Marco Fanciulli ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Quantum Devices ◽  
Printed Circuit
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