Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints

2021 ◽  
Vol 127 ◽  
pp. 114381
Author(s):  
Ved Prakash Sharma ◽  
Naresh Varma Datla
Keyword(s):  
Aging Time ◽  
Fracture Behavior ◽  
Loading Rate ◽  
Solder Joints

Loading rate effect on fracture behavior of fiber reinforced high strength concrete using a semi-circular bending test

2020 ◽  
Vol 240 ◽  
pp. 117681
Author(s):  
Mehran Aziminezhad ◽  
Sahand Mardi ◽  
Pouria Hajikarimi ◽  
Fereidoon Moghadas Nejad ◽  
Amir H. Gandomi
Keyword(s):  
High Strength Concrete ◽  
Fracture Behavior ◽  
Loading Rate ◽  
High Strength ◽  
Rate Effect ◽  
Bending Test ◽  
Fiber Reinforced ◽  
Strength Concrete

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010 ◽  
Vol 25 (7) ◽  
pp. 1312-1320 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Fracture Energy ◽  
Microstructure Evolution ◽  
Thermal Cycle ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Solder Joints ◽  
Whisker Formation ◽  
Structural Variations ◽  
Before And After ◽  
Ball Joints

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

FRACTURE BEHAVIOR OF Zr-BASED BULK METALLIC GLASS UNDER IMPACT LOADING

2006 ◽  
Vol 20 (25n27) ◽  
pp. 4359-4364 ◽  
Author(s):  
HYUNG-SEOP SHIN ◽  
KI-HYUN KIM ◽  
SANG-YEOB OH
Keyword(s):  
Fracture Toughness ◽  
Crack Initiation ◽  
Fracture Energy ◽  
Impact Loading ◽  
Static Loading ◽  
Fracture Behavior ◽  
Loading Rate ◽  
Shear Bands ◽  
Maximum Load ◽  
Cu Alloy

The fracture behavior of a Zr -based bulk amorphous metal under impact loading using subsize V-shaped Charpy specimens was investigated. Influences of loading rate on the fracture behavior of amorphous Zr - Al - Ni - Cu alloy were examined. As a result, the maximum load and absorbed fracture energy under impact loading were lower than those under quasi-static loading. A large part of the absorbed fracture energy in the Zr -based BMG was consumed in the process for crack initiation and not for crack propagation. In addition, fractographic characteristics of BMGs, especially the initiation and development of shear bands at the notch tip were investigated. Fractured surfaces under impact loading are smoother than those under quasi-static loading. The absorbed fracture energy appeared differently depending on the appearance of the shear bands developed. It can be found that the fracture energy and fracture toughness of Zr -based BMG are closely related with the extent of shear bands developed during fracture.

Recent Development on Fracture Analysis of Solder Joints

2014 ◽  
Vol 695 ◽  
pp. 680-683
Author(s):  
E.P. Ooi ◽  
R. Daud ◽  
N.A.M. Amin ◽  
T.W. Hong
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Electronic Devices ◽  
Fracture Analysis ◽  
Fracture Load ◽  
Mixed Mode Loading ◽  
Vibration Loading ◽  
Prevalent Fracture ◽  
Recent Fracture ◽  
Impact Vibration

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. In reality, the solder joints are exposed to drop impact, vibration loading, bending, and twisting of PCBs. Study on this matter will lead to prediction of fracture load, prevalent fracture mode, exact joint interconnect size and life of joints under brittle and fatigue failure. This paper presents a review of recent fracture analysis on solder joints.

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