Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010 ◽  
Vol 25 (7) ◽  
pp. 1312-1320 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Fracture Energy ◽  
Microstructure Evolution ◽  
Thermal Cycle ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Solder Joints ◽  
Whisker Formation ◽  
Structural Variations ◽  
Before And After ◽  
Ball Joints

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

The micro-impact fracture behavior of lead-free solder ball joints

2008 ◽  
Vol 23 (4) ◽  
pp. 1057-1063 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Solder Joint ◽  
Fracture Energy ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Impact Fracture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Impact Fracture Behavior ◽  
Free Solder ◽  
Ball Joints

The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn–1Ag–0.1Cu–0.02Ni–0.05In, Sn–1.2Ag–0.5Cu–0.05Ni, and Sn–1Ag–0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.

scholarly journals Deformation Evaluation of Solder Ball Joints by Electromotive Force

2008 ◽  
Vol 13-14 ◽  
pp. 233-238
Author(s):  
T. Kumazawa ◽  
K. Kaminishi
Keyword(s):  
Solder Joint ◽  
Electromotive Force ◽  
Solder Ball ◽  
Solder Joints ◽  
Shear Fracture ◽  
Testing Machine ◽  
Copper Layer ◽  
Deformation Test ◽  
Ball Joints ◽  
Deformation Measurements

Deformation measurements with a thermocouple were applied in a deformation test of solder joints. The thermocouple is effectively combined with a conventional testing machine. The lead–solder and non–lead solder joints were pulled and sheared. The load-displacement and electromotive force (Emf)–displacement curves can be continuously derived from the signals of a load cell and the thermocouple. The Emfs in tension were compared with that in shear. The maximum Emf value in tension was larger than the emf value in shear, which meant in weakness of the solder joint in shear. Fracture occurred at the interface between the copper layer pad and solder, and the obtained Emf is closely related to fracture at the interface. The maximum Emf value in the non-lead solder was smaller than the Emf value in the lead–solder.

Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

2016 ◽  
Vol 673 ◽  
pp. 167-177 ◽  
Author(s):  
Xiaowu Hu ◽  
Tao Xu ◽  
Leon M. Keer ◽  
Yulong Li ◽  
Xiongxin Jiang
Keyword(s):  
Microstructure Evolution ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Shear Fracture

Fracture Properties of Porous MSSQ Films: Impact of Porogen Loading and Burnout

2006 ◽  
Vol 914 ◽  
Author(s):  
Markus D Ong ◽  
Vincent Jousseaume ◽  
Sylvain Maitrejean ◽  
Reinhold H. Dauskardt
Keyword(s):  
Fracture Energy ◽  
Hybrid Materials ◽  
Fracture Behavior ◽  
Fracture Properties ◽  
Fracture Surfaces ◽  
Before And After ◽  
Fracture Interface

AbstractThis work investigates the effect of porogen loading on the fracture properties of methylsilsesquioxane (MSSQ) both before and after the porogen burnout process. The fracture behavior of the hybrid porogen/matrix materials differed significantly from that of the post-burnout materials. The most notable differences were alternative fracture paths and a trend of increasing fracture energy with increasing porogen loading. Characterization of the fracture surfaces indicate increasing amounts of carbon at the fracture interface corresponding to the increases in fracture energy and suggest bridging porogen molecules may be responsible for the increase in adhesion for the hybrid materials.

scholarly journals The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Metals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 518 ◽  
Author(s):  
Congcong Cao ◽  
Keke Zhang ◽  
Baojin Shi ◽  
Huigai Wang ◽  
Di Zhao ◽  
...  
Keyword(s):  
Shear Strength ◽  
Fracture Mechanism ◽  
Thermal Cycle ◽  
Solder Joints ◽  
Joint Interface ◽  
Interface Microstructure ◽  
Average Thickness ◽  
Thermal Cycles ◽  
Initial State ◽  
Cycle Loading

The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.

Microstructure Evolution and Mechanical Properties of the Ni/Ni Soldered Joints

2011 ◽  
Vol 172-174 ◽  
pp. 863-868
Author(s):  
Anna Sypień ◽  
Andrzej Piątkowski ◽  
Paweł Zięba
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Chemical Composition ◽  
Microstructure Evolution ◽  
Fracture Behavior ◽  
Bulk Solder ◽  
Subsequent Aging ◽  
Brittle Phase ◽  
Edx Microanalysis ◽  
Solder Interface

The paper presents the results of studies on the microstructure, chemical composition and mechanical properties of the Ni/SnAuCu/Ni interconnections obtained due to the conventional soldering at 300 °C for different times and subsequent aging at 150 °C. The EDX microanalysis allowed to detect at the Ni/solder interface the (Ni,Cu,Au)3Sn4phase which transformed to (Cu,Ni,Au)6Sn5after longer time of soldering. In the central part of the interconnection AuSn4brittle phase was present. This phase was responsible for the significant decrease of the shear strength in the joints subjected to aging at 150 °C for 1000h, 1500 hours. The fracture behavior of such joints appeared to be caused partly by the coalescence of the microvoids in the bulk solder, cleavage of η-phase grains and decohesion at the interface.

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