Automotive optoelectronic components submitted to thermal shock: Impact of component architecture on mechanical reliability

2022 ◽  
Vol 128 ◽  
pp. 114422
Author(s):  
Safa NOCAIRI ◽  
Khalil Maarouf ◽  
Christine Roucoules ◽  
Guillaume Kermouche ◽  
Sergio Sao-Joao ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Mechanical Reliability ◽  
Component Architecture ◽  
Shock Impact

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

2018 ◽  
Vol 47 (7) ◽  
pp. 4165-4169 ◽  
Author(s):  
Yong-Gue Sung ◽  
Woo-Ram Myung ◽  
Haksan Jeong ◽  
Min-Kwan Ko ◽  
Jeonghoon Moon ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Mechanical Reliability ◽  
Surface Finishes

SrO-Containing Diopside Glass-Ceramic Sealants for Solid Oxide Fuel Cells: Mechanical Reliability and Thermal Shock Resistance

Fuel Cells ◽  
2013 ◽  
pp. n/a-n/a ◽  
Author(s):  
A. A. Reddy ◽  
D. U. Tulyaganov ◽  
M. J. Pascual ◽  
V. V. Kharton ◽  
E. V. Tsipis ◽  
...  
Keyword(s):  
Fuel Cells ◽  
Solid Oxide Fuel Cells ◽  
Thermal Shock ◽  
Glass Ceramic ◽  
Thermal Shock Resistance ◽  
Solid Oxide ◽  
Oxide Fuel ◽  
Mechanical Reliability ◽  
Shock Resistance

Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

2020 ◽  
Vol 112 ◽  
pp. 113918
Author(s):  
Haksan Jeong ◽  
Kyung Deuk Min ◽  
Choong-Jae Lee ◽  
Jae-Ha Kim ◽  
Seung-Boo Jung
Keyword(s):  
Thermal Shock ◽  
Solder Ball ◽  
Flip Chip ◽  
Thermal Shock Test ◽  
Mechanical Reliability ◽  
Shock Test

scholarly journals Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints

Materials ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 94 ◽  
Author(s):  
Jiajie Fan ◽  
Jie Wu ◽  
Changzhen Jiang ◽  
Hao Zhang ◽  
Mesfin Ibrahim ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Solder Joints ◽  
Light Emitting Diode ◽  
Shock Load ◽  
Thermal Shock Test ◽  
Mechanical Reliability ◽  
Light Emitting

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and reliability of solder joints. This paper models the 3D random voids generation in the LED flip chip Sn96.5–Ag3.0–Cu0.5 (SAC305) solder joint, and investigates the effect of thermal shock load on its mechanical reliability with both simulations and experiments referring to the JEDEC thermal shock test standard (JESD22-A106B). The results reveal the following: (1) the void rate of the solder joint increases after thermal shock ageing, and its shear strength exponentially degrades; (2) the first principal stress of the solder joint is not obviously increased, however, if the through-hole voids emerged in the corner of solder joints, it will dramatically increase; (3) modelling of the fatigue failure of solder joint with randomly distributed voids utilizes the approximate model to estimate the lifetime, and the experimental results confirm that the absolute prediction error can be controlled around 2.84%.

A controller for safe, convenient operation of LaB6 emitters on electron-beam instruments

1983 ◽  
Vol 41 ◽  
pp. 408-409
Author(s):  
W. J. Abramson ◽  
H. W. Estry ◽  
L. F. Allard
Keyword(s):  
Electron Beam ◽  
Control System ◽  
Thermal Shock ◽  
Appropriate Care ◽  
Electron Guns ◽  
Tungsten Filaments ◽  
Order Of Magnitude ◽  
Main Components

LaB6 emitters are becoming increasingly popular as direct replacements for tungsten filaments in the electron guns of modern electron-beam instruments. These emitters offer order of magnitude increases in beam brightness, and, with appropriate care in operation, a corresponding increase in source lifetime. They are, however, an order of magnitude more expensive, and may be easily damaged (by improper vacuum conditions and thermal shock) during saturation/desaturation operations. These operations typically require several minutes of an operator's attention, which becomes tedious and subject to error, particularly since the emitter must be cooled during sample exchanges to minimize damage from random vacuum excursions. We have designed a control system for LaBg emitters which relieves the operator of the necessity for manually controlling the emitter power, minimizes the danger of accidental improper operation, and makes the use of these emitters routine on multi-user instruments.Figure 1 is a block schematic of the main components of the control system, and Figure 2 shows the control box.

Degradation Behavior of TiN Coatings with Different Thicknesses after a Pulsed Laser Thermal Shock Test

2013 ◽  
Vol 51 (10) ◽  
pp. 729-734 ◽  
Author(s):  
Seol Jeon ◽  
Youngkue Choi ◽  
Hyun-Gyoo Shin ◽  
Hyun Park ◽  
Heesoo Lee ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Pulsed Laser ◽  
Thermal Shock Test ◽  
Degradation Behavior ◽  
Shock Test ◽  
Tin Coatings

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

2010 ◽  
Vol 48 (11) ◽  
pp. 1035-1040 ◽  
Author(s):  
Young-Chul Lee ◽  
Kwang-Seok Kim ◽  
Ji-Hyuk Ahn ◽  
Jeong-Won Yoon ◽  
Min-Kwan Ko ◽  
...  
Keyword(s):  
Solder Joint ◽  
Mechanical Reliability
Sign in / Sign up

Export Citation Format

Share Document