Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

2010 ◽  
Vol 48 (11) ◽  
pp. 1035-1040 ◽  
Author(s):  
Young-Chul Lee ◽  
Kwang-Seok Kim ◽  
Ji-Hyuk Ahn ◽  
Jeong-Won Yoon ◽  
Min-Kwan Ko ◽  
...  
Keyword(s):  
Solder Joint ◽  
Mechanical Reliability

Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

2006 ◽  
Vol 21 (12) ◽  
pp. 3196-3204 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Jun Hyung Lim ◽  
Hoo-Jeong Lee ◽  
Jinho Joo ◽  
Seung-Boo Jung ◽  
...  
Keyword(s):  
Solder Joint ◽  
Eutectic Reaction ◽  
Bulk Solder ◽  
Interfacial Reactions ◽  
Test Results ◽  
Mechanical Reliability ◽  
Viable Option ◽  
Reaction Behavior ◽  
Cu Substrate ◽  
Joint Reliability

Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn–Pb solder produced a Pb-rich phase along the interface between the solder and the Cu substrate during aging. In contrast, the Sn–Ag solder exhibits an off-eutectic reaction to produce the eutectic phase and Ag3Sn precipitate. The shear test results show that the Sn–Pb solder joint fractured along the interface showing brittle failure indications possibly due to the brittle Pb-rich layer. In contrast, the failure of Sn–Ag solder joint was only through the bulk solder, providing evidence that the interface is mechanically reliable. The results from this study confirm that the immersion Ag/Sn–Ag solder joint is mechanically robust, and thus the combination is a viable option for a Pb-free package system.

scholarly journals Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint

2016 ◽  
Vol 57 (11) ◽  
pp. 1966-1971
Author(s):  
Sang Su Ha ◽  
Hanbyul Kang ◽  
Gun Rae Kim ◽  
Sangwoo Pae ◽  
Haebum Lee
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Mechanical Reliability

Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint

2011 ◽  
Vol 88 (5) ◽  
pp. 709-714 ◽  
Author(s):  
Sang-Su Ha ◽  
Ji-Yoon Sung ◽  
Jeong-Won Yoon ◽  
Seung-Boo Jung
Keyword(s):  
Solder Joint ◽  
Current Density ◽  
Mechanical Reliability

Mechanical reliability of self-aligned chip assembly after reflow soldering process

2020 ◽  
Vol 33 (1) ◽  
pp. 9-17
Author(s):  
Mohd Najib Ali Mokhtar ◽  
M.Z. Abdullah ◽  
Abdullah Aziz Saad ◽  
Fakhrozi Cheani
Keyword(s):  
Shear Strength ◽  
Statistical Analysis ◽  
Solder Joint ◽  
Silver Content ◽  
The Self ◽  
Mechanical Reliability ◽  
Reflow Soldering ◽  
Content Type ◽  
Strength Assessment ◽  
Soldering Process

Purpose This paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint quality of the self-alignment assemblies of SnAg alloy solder joints with varying silver content. Design/methodology/approach The shear strength assessment was conducted in accordance with the JIS Z3 198-7 standard. The standard visual inspection of IPC-A-610G was also performed to inspect the self-alignment features of the solder joint samples. Statistical analysis was conducted to determine the probabilistic relationship of shear strength of the misalignment components. Findings The results from the mechanical reliability study indicate that there were decreasing trends in the shear strength value as misalignment offset increased. For shift mode configuration in the range of 0-300 µm, the resulting chip assembly inspection after the reflow process was in line with the IPC-A-610G standard. The statistical analysis shows that the solder type variation was insignificant to the shear strength of the chip resistor. The study concluded that the fracture occurred partially in the termination metallization at the lower part of the chip resistor. The copper content of the joint on that area shows that the crack occurred in the solder joint, and high silver content on the selected zone indicated that the fracture happened partially in the termination structure, as the termination structure of the lead-free chip resistor consists of an inner layer of silver and an outer layer of tin. Practical implications This study’s findings provide valuable guidelines and references to engineers and integrated circuit designers during the reflow soldering process in the microelectronics industry. Originality/value Studies on the effect of component misalignment on joint mechanical reliability are still limited, and studies on solder joint reliability involving the effect of differing contents of silver on varying chip component offset are rarely reported. Thus, this study is important to effectively bridge the research gap and yield appropriate guidelines in the potential industry.

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