Stripping of relativistic uranium-ion beams by foils

Author(s):  
V.P. Shevelko ◽  
N. Winckler ◽  
Inga Yu. Tolstikhina
Keyword(s):  
Author(s):  
Hiroo Hasebe ◽  
Hironori Kuboki ◽  
Hiroki Okuno ◽  
Nobuhisa Fukunishi ◽  
Osamu Kamigaito ◽  
...  

Author(s):  
L. Bozyk ◽  
F. Chill ◽  
M.S. Litsarev ◽  
I.Yu. Tolstikhina ◽  
V.P. Shevelko
Keyword(s):  

1985 ◽  
Author(s):  
I.G. Brown ◽  
J.E. Galvin ◽  
R. Keller ◽  
P. Spaedtke ◽  
R.W Mueller ◽  
...  
Keyword(s):  

Author(s):  
Hiroo Hasebe ◽  
Hiroki Okuno ◽  
Hironori Kuboki ◽  
Hiromichi Ryuto ◽  
Nobuhisa Fukunishi ◽  
...  

Author(s):  
I.G. Brown ◽  
J.E. Galvin ◽  
R. Keller ◽  
P. Spädtke ◽  
R.W. Müller ◽  
...  
Keyword(s):  

1988 ◽  
Vol 102 ◽  
pp. 339-342
Author(s):  
J.M. Laming ◽  
J.D. Silver ◽  
R. Barnsley ◽  
J. Dunn ◽  
K.D. Evans ◽  
...  

AbstractNew observations of x-ray spectra from foil-excited heavy ion beams are reported. By observing the target in a direction along the beam axis, an improvement in spectral resolution, δλ/λ, by about a factor of two is achieved, due to the reduced Doppler broadening in this geometry.


Author(s):  
John F. Walker ◽  
J C Reiner ◽  
C Solenthaler

The high spatial resolution available from TEM can be used with great advantage in the field of microelectronics to identify problems associated with the continually shrinking geometries of integrated circuit technology. In many cases the location of the problem can be the most problematic element of sample preparation. Focused ion beams (FIB) have previously been used to prepare TEM specimens, but not including using the ion beam imaging capabilities to locate a buried feature of interest. Here we describe how a defect has been located using the ability of a FIB to both mill a section and to search for a defect whose precise location is unknown. The defect is known from electrical leakage measurements to be a break in the gate oxide of a field effect transistor. The gate is a square of polycrystalline silicon, approximately 1μm×1μm, on a silicon dioxide barrier which is about 17nm thick. The break in the oxide can occur anywhere within that square and is expected to be less than 100nm in diameter.


Sign in / Sign up

Export Citation Format

Share Document