scholarly journals Compressor Reliability Improvement

2016 ◽  
Vol 150 ◽  
pp. 448-452 ◽  
Author(s):  
K.N. Voinov ◽  
A.Yu. Grigor’ev ◽  
K.A. Grigor’ev
2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  

Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


1978 ◽  
Author(s):  
J. L. Easterday ◽  
J. E. Drennan ◽  
L. R. Albrechtson ◽  
W. Gordon

Author(s):  
Yuri R. Rodrigues ◽  
Morad Mohamed Abdelmageed Abdelaziz ◽  
Liwei Wang ◽  
Innocent Kamwa

Author(s):  
Mehadi Aman ◽  
Yujiro Takeda ◽  
Kazuatsu Ito ◽  
Kaoru Yamamoto ◽  
Kohei Tanaka ◽  
...  

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