Two-step hybrid process of movable part inside glass substrate using ultrafast laser

We demonstrate a two-step hybrid process for fabricating movable parts inside glass substrate using the selective laser-induced etching (SLE) process that is consisted of laser-direct writing and wet chemical etching. To obtain an influence by the optical characteristics of a glass substrate when fabricating a 3D microstructure using the SLE, we analyzed the relationship of their dimensions between the designed and the fabricated devices. Two 3D microfluidic devices are designed and fabricated on glass substrates as the demonstrations of the hybrid process: a 3D microfluidic valve device with a movable plug and a 3D microfluidic mixer with a rotatable impeller and multilayer microchannels. The valving plug and the impeller of each device are successfully moved and rotated. The smallest structure is a pillar of the impeller device, and its size is 29 μm (diameter) × 277 μm (height). We expect this study to be extended to potential applications in 3D glass microfabrication and microfluidic systems.

Study on Improving the Precise Machinability of Single Crystal SiC by an Ultrasonic-Assisted Hybrid Process

Silicon carbide (SiC) devices have become one of the key research directions in the field of power electronics. However, due to the limitation of the SiC wafer growth process and processing capacity, SiC devices, such as SiC MOSFET (Metal-oxide-semiconductor Field-effect Transistor), are facing the problems of high cost and unsatisfied performance. To improve the precise machinability of single-crystal SiC wafer, this paper proposed a new hybrid process. Firstly, we developed an ultrasonic vibration-assisted device, by which ultrasonic-assisted lapping and ultrasonic-assisted CMP (chemical mechanical polishing) for SiC wafer were fulfilled. Secondly, a novel three-step ultrasonic-assisted precise machining route was proposed. In the first step, ultrasonic lapping using a cast iron disc was conducted, which quickly removed large surface damages with a high MRR (material removal rate) of 10.93 μm/min. In the second step, ultrasonic lapping using a copper disc was conducted, which reduced the residual surface defects with a high MRR of 6.11 μm/min. In the third step, ultrasonic CMP using a polyurethane pad was conducted, which achieved a smooth and less damaged surface with an MRR of 1.44 μm/h. These results suggest that the ultrasonic-assisted hybrid process can improve the precise machinability of SiC, which will hopefully achieve high-efficiency and ultra-precision machining.

Automated platform for consistent part realization with regenerative hybrid additive manufacturing workflow

Nowadays, the role of hybridization within the wider manufacturing ecosystem gains significant momentum with multiple commercial solutions already available on the market. Despite the very promising benefits of combining and selectively exploiting the advantages of additive and subtractive technologies on the same machine, hybrid additive manufacturing is far from reaching its full potential. One of the central limitations of existing hybrid process chains is the lack of a harmonized, structured and automated workflows to support an adaptive manufacturing strategy. This work is motivated by the need to bridge this gap and to capture the logic behind an adaptive hybrid process chain with the aim to support the achievement of enhanced product quality and improved operational efficiency in hybrid additive manufacturing. The paper discusses the implementation of a hybrid CAx platform and the underlying methodology aiming at the dynamic reduction of variabilities associated with the laser metal deposition process. The hybrid workflow identifies the most adapted sequence and planning of additive and subtractive operations while considering part inspection as an in-envelope functionality to quantify the geometrical and dimensional part deviations and to trigger the regenerative mechanism. The methodology is demonstrated on a hybrid machine by deploying laser ablation for the in situ removal of build deviations and an adapted deposition operation as part of a regenerative strategy leading to higher part confidence.