Reliability improvement of IGZO‐TFT in hybrid process with LTPS

2021 ◽  
Author(s):  
Mehadi Aman ◽  
Yujiro Takeda ◽  
Kazuatsu Ito ◽  
Kaoru Yamamoto ◽  
Kohei Tanaka ◽  
...  
Keyword(s):  
Hybrid Process ◽  
Reliability Improvement ◽  
Igzo Tft

7‐1: Distinguished Paper: Reliability Improvement of IGZO‐TFT in Hybrid Process with LTPS

2021 ◽  
Vol 52 (1) ◽  
pp. 57-60
Author(s):  
Mehadi Aman ◽  
Yujiro Takeda ◽  
Kazuatsu Ito ◽  
Kaoru Yamamoto ◽  
Kohei Tanaka ◽  
...  
Keyword(s):  
Hybrid Process ◽  
Reliability Improvement ◽  
Igzo Tft

Reliability Improvement of Ground Fault Protection System Using an S-Type Horn Attachment Gap in AC Feeding System

2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  
Keyword(s):  
Protection System ◽  
Feeding System ◽  
Reliability Improvement ◽  
Ground Fault ◽  
Fault Protection ◽  
Ground Fault Protection

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

Ka-Band Reliability Improvement. Part I. Volume III. Ka-Band SATCOM Set Analysis. Appendix C

1978 ◽  
Author(s):  
J. L. Easterday ◽  
J. E. Drennan ◽  
L. R. Albrechtson ◽  
W. Gordon
Keyword(s):  
Ka Band ◽  
Reliability Improvement
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