In situ study of stress relaxation mechanisms of pure Al thin films during isothermal annealing

2006 ◽  
Vol 54 (11) ◽  
pp. 1841-1846 ◽  
Author(s):  
Soo-Jung Hwang ◽  
Yong-Duck Lee ◽  
Young-Bae Park ◽  
Je-Hun Lee ◽  
Chang-Oh Jeong ◽  
...  
2006 ◽  
Vol 924 ◽  
Author(s):  
Young-Bae Park ◽  
Soo-Jung Hwang ◽  
Yong-Duk Lee ◽  
Ja-Young Jung ◽  
Young-Chang Joo

ABSTRACTThe in-situ SEM observation of real-time hillock evolution in pure Al thin films on glass substrate during isothermal annealing at 194°C was analyzed quantitatively to understand the compressive stress relaxation mechanism by focusing on the effect of Mo interlayer between Al film and glass substrate. There is a good correlation between the hillock-induced stress relaxation and the measured stress relaxation by wafer curvature method. It is also clearly shown that the existence of Mo interlayer plays an important role in hillock formation probably due to the large difference in interfacial diffusivity of Al films.


1991 ◽  
Vol 239 ◽  
Author(s):  
A. Mutscheller ◽  
L. A. Clevenger ◽  
J.M.E. Harper ◽  
C. Cabrai ◽  
K. Barmakt

AbstractWe demonstrate that the high temperature polymorphic tantalum phase transition from the tetragonal beta phase to the cubic alpha phase causes complete stress relaxation and a large decrease in the resistance of tantalum thin films. 100 nm beta tantalum thin films were deposited onto thermally oxidized <100> silicon wafers by dc magnetron sputtering with argon. In situ stress and resistance at temperature were measured during temperature-ramped annealing in purified He. Upon heating, films that were initially compressively stressed showed increasing compressive stress due to thermo-elastic deformation from 25 to 550°C, slight stress relief due to plastic deformation from 550 to 700°C and complete stress relief due to the beta to alpha phase transformation at approximately 700–800°C. Incomplete compressive stress relaxation was observed at high temperatures if the film was initially deposited in the alpha phase or if the beta phase did not completely transform into alpha by 800°C. This incomplete beta to alpha phase transition was most commonly observed on samples that had radio frequency substrate bias greater than -100 V. We conclude that the main stress relief mechanism for tantalum thin films is the beta to alpha phase transformation that occurs at 700 to 800°C.


2018 ◽  
Vol 33 (8) ◽  
pp. 085001
Author(s):  
Atzin David Ruíz Pérez ◽  
M B de la Mora ◽  
J L Benítez ◽  
R Castañeda-Guzmán ◽  
Jorge Alejandro Reyes-Esqueda ◽  
...  

2011 ◽  
Vol 17 (S2) ◽  
pp. 798-799
Author(s):  
R Tao ◽  
R Klie ◽  
A Romanenko ◽  
L Cooley

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.


2019 ◽  
Vol 50 (8) ◽  
pp. 3555-3565 ◽  
Author(s):  
P. E. Aba-Perea ◽  
P. J. Withers ◽  
T. Pirling ◽  
A. Paradowska ◽  
D. Ma ◽  
...  

2020 ◽  
Vol 12 (51) ◽  
pp. 57627-57637
Author(s):  
Nian Li ◽  
Wei Chen ◽  
Lin Song ◽  
Renjun Guo ◽  
Manuel A. Scheel ◽  
...  

2022 ◽  
pp. 139095
Author(s):  
Elizabeth Palmiotti ◽  
Benjamin Belfore ◽  
Deewakar Poudel ◽  
Sylvain Marsillac ◽  
Angus Rockett
Keyword(s):  

2002 ◽  
Vol 12 (3) ◽  
pp. 557-564 ◽  
Author(s):  
Ludivine Pidol ◽  
David Grosso ◽  
Galo J. A. A. Soler-Illia ◽  
Eduardo L. Crepaldi ◽  
Clément Sanchez ◽  
...  

2012 ◽  
Vol 18 (S2) ◽  
pp. 1624-1625
Author(s):  
R. Tao ◽  
R. Klie ◽  
A. Romanenko ◽  
L. Cooley

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.


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