High temperature dielectric loss of h-BN at X band and its dependence on the electron structure, defects and impurities

2010 ◽  
Vol 12 (9) ◽  
pp. 1599-1602 ◽  
Author(s):  
Ting Zhang ◽  
Mengqiang Wu ◽  
Shuren Zhang ◽  
Jinming Wang ◽  
Dahai Zhang ◽  
...  
1998 ◽  
Vol 42 (12) ◽  
pp. 2183-2185 ◽  
Author(s):  
R Hickman ◽  
J.M Van Hove ◽  
P.P Chow ◽  
J.J Klaassen ◽  
A.M Wowchack ◽  
...  

2019 ◽  
Vol 6 (9) ◽  
pp. 096312
Author(s):  
Junnan Zhang ◽  
Xuening Rong ◽  
Chang Xu ◽  
Aming Xie ◽  
Shuxin Deng

Author(s):  
An-Phuc Hoang ◽  
Sebastian Steiner ◽  
Fan Yang ◽  
Linhao Li ◽  
Derek C. Sinclair ◽  
...  

2020 ◽  
Vol 40 (3) ◽  
pp. 720-727 ◽  
Author(s):  
Yulong Qiao ◽  
Weili Li ◽  
Yulei Zhang ◽  
Lu Jing ◽  
Xinrui Yang ◽  
...  

2007 ◽  
Vol 18 (3-4) ◽  
pp. 277-282 ◽  
Author(s):  
Héctor Beltrán ◽  
Nahum Masó ◽  
Eloisa Cordoncillo ◽  
Anthony R. West

2019 ◽  
Vol 960 ◽  
pp. 256-262
Author(s):  
Guang Yu Duan ◽  
Zu Ming Hu

A high-temperature poly (m-phenyleneisophthalamide) (PMIA) dielectric composite was successfully manufactured with functionalized BN (fBN) fillers. Due to effective modification by KH-550, fBN particles evenly dispersed in PMIA matrix. The dielectric property, breakdown strength and thermal conductivity of PMIA/fBN dielectric composite were researched. The consequences indicate that fBN fillers can not only decrease the dielectric loss but also enhance the breakdown strength of PMIA/fBN dielectric composites. Furthermore, owing to the generated heat transfer pathways by fBN particles, the thermal conductivities improved from 0.23 W·m-1·K-1 of fBN-0 to 0.86 W·m-1·K-1 of fBN-30, demonstrating a significant improvement. These results present a novel method for fabricating high-temperature PMIA/fBN dielectric composites with improved breakdown strength and thermal conductivity.


Author(s):  
L. Gao ◽  
Z.Y. Jiang ◽  
J.Q. Liu ◽  
H.Y. Liu ◽  
J.L. Bai ◽  
...  

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