Tailoring of titanium thin film properties in high power pulsed magnetron sputtering

Vacuum ◽  
2018 ◽  
Vol 150 ◽  
pp. 144-154 ◽  
Author(s):  
Baohua Wu ◽  
Yan Yu ◽  
Jian Wu ◽  
Ivan Shchelkanov ◽  
David N. Ruzic ◽  
...  
Keyword(s):  
Thin Film ◽  
Magnetron Sputtering ◽  
High Power ◽  
Film Properties ◽  
Titanium Thin Film ◽  
Pulsed Magnetron

Optimal target sputtering mode for aluminum nitride thin film deposition by high power pulsed magnetron sputtering

Vacuum ◽  
2019 ◽  
Vol 160 ◽  
pp. 410-417 ◽  
Author(s):  
D.L. Ma ◽  
H.Y. Liu ◽  
Q.Y. Deng ◽  
W.M. Yang ◽  
K. Silins ◽  
...  
Keyword(s):  
Thin Film ◽  
Aluminum Nitride ◽  
Magnetron Sputtering ◽  
High Power ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Optimal Target ◽  
Pulsed Magnetron

scholarly journals Effect of Ion Energy on the Microstructure and Properties of Titanium Nitride Thin Films Deposited by High Power Pulsed Magnetron Sputtering

Coatings ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 579
Author(s):  
Donglin Ma ◽  
Qiaoyuan Deng ◽  
Huaiyuan Liu ◽  
Yongxiang Leng
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Residual Stress ◽  
Magnetron Sputtering ◽  
Titanium Nitride ◽  
High Power ◽  
Substrate Bias Voltage ◽  
Ion Energy ◽  
Tools Wear ◽  
Pulsed Magnetron

Titanium nitride (Ti-N) thin films are electrically and thermally conductive and have high hardness and corrosion resistance. Dense and defect-free Ti-N thin films have been widely used in the surface modification of cutting tools, wear resistance components, medical implantation devices, and microelectronics. In this study, Ti-N thin films were deposited by high power pulsed magnetron sputtering (HPPMS) and their plasma characteristics were analyzed. The ion energy of Ti species was varied by adjusting the substrate bias voltage, and its effect on the microstructure, residual stress, and adhesion of the thin films were studied. The results show that after the introduction of nitrogen gas, a Ti-N compound layer was formed on the surface of the Ti target, which resulted in an increase in the Ti target discharge peak power. In addition, the total flux of the Ti species decreased, and the ratio of the Ti ions increased. The Ti-N thin film deposited by HPPMS was dense and defect-free. When the energy of the Ti ions was increased, the grain size and surface roughness of the Ti-N film decreased, the residual stress increased, and the adhesion strength of the Ti-N thin film decreased.

Chromium films deposition by hot target high power pulsed magnetron sputtering: Deposition conditions and film properties

2019 ◽  
Vol 375 ◽  
pp. 352-362 ◽  
Author(s):  
Vladislav A. Grudinin ◽  
Galina A. Bleykher ◽  
Dmitrii V. Sidelev ◽  
Valery P. Krivobokov ◽  
Massimiliano Bestetti ◽  
...  
Keyword(s):  
Magnetron Sputtering ◽  
High Power ◽  
Film Properties ◽  
Sputtering Deposition ◽  
Chromium Films ◽  
Hot Target ◽  
Deposition Conditions ◽  
Pulsed Magnetron

Pulse synchronized substrate bias for the High Power Pulsed Magnetron Sputtering deposition of CrAlN

2021 ◽  
pp. 138792
Author(s):  
K. Bobzin ◽  
T. Brögelmann ◽  
N.C. Kruppe ◽  
M. Engels ◽  
C. Schulze
Keyword(s):  
Magnetron Sputtering ◽  
High Power ◽  
Substrate Bias ◽  
Sputtering Deposition ◽  
Pulsed Magnetron

ZrCuAlNi thin film metallic glass grown by high power impulse and direct current magnetron sputtering

2021 ◽  
pp. 127029
Author(s):  
Niklas Bönninghoff ◽  
Wahyu Diyatmika ◽  
Jinn P. Chu ◽  
Stanislav Mráz ◽  
Jochen M. Schneider ◽  
...  
Keyword(s):  
Thin Film ◽  
Metallic Glass ◽  
Magnetron Sputtering ◽  
Direct Current ◽  
High Power ◽  
Direct Current Magnetron Sputtering
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