Simulation of the effect of argon pressure on thermal processes in the sputtering unit of a magnetron with a hot target

Vacuum ◽  
2021 ◽  
pp. 110421
Author(s):  
Viktor I. Shapovalov ◽  
Hacı Ahmedov ◽  
Aleksandr A. Kozin ◽  
Arif Demir ◽  
Beste Korutlu
2016 ◽  
Vol 56 (6) ◽  
pp. 425-431
Author(s):  
Alena Olegovna Borduleva ◽  
Galina Alekseevna Bleykher ◽  
Dmitrii Vladimirovich Sidelev ◽  
Valeriy Pavlovich Krivobokov

This work focuses on erosion and thermal processes taking place on the surface of the titanium target in magnetron sputtering. The study was carried out using magnetron sputtering systems (MSS) with different thermal insulation target types from the magnetron body. It was found that the presence of an evaporation component allows the rate of removal of atoms from the surface of a solid target to be increased with limited thermal conduction. A mathematical simulation was used to evaluate the contribution of evaporation to the increase in the coating deposition rate for complete and partial thermal insulation. It was found that non-uniformity of the direct-axis component of the magnetic induction vector helps to localize the heating. also increases the evaporation rate on the surface of the target. It was proved that local evaporation including sublimations on the surface of a hot target is a significant factor in increasing the coating deposition rate. Due to this mechanism, the coating deposition rate can be increased 5 times for Ti in comparison with fully cooled targets. This result can be applied for direct current magnetrons and also for pulsed systems. It was also found that evaporation increased the energy efficiency of the target erosion. The most suitable metals were selected for obtaining high-intensity emission of atoms from a solid target.


2020 ◽  
Vol 1713 ◽  
pp. 012021
Author(s):  
A A Kozin ◽  
V I Shapovalov ◽  
H Ahmedov ◽  
A Demir ◽  
B Korutlu ◽  
...  
Keyword(s):  

2018 ◽  
pp. 155-162 ◽  
Author(s):  
Sergei S. Kapitonov ◽  
Anastasia V. Kapitonova ◽  
Sergei Yu. Grigorovich ◽  
Sergei A. Medvedev ◽  
Taher Sobhy

In the article, the electrical and thermal processes in the LED lamp with varied parameters are investigated. Voltage and current measurements on all LEDs of the luminaire are carried out in the nominal operating mode. The power allocated to each LED is determined. The calculation of the LED crystal temperature was carried out using the developed thermal LED model based on the results of the measurements and by using “Multisim” program. It has been established that the temperature of the crystals of individual LEDs in the luminaire differ significantly, which leads to unfavourable thermal conditions for them and an increased likelihood of premature failure.


Author(s):  
Yu. P. Morozov

Based on the solution of the problem of non-stationary heat transfer during fluid motion in underground permeable layers, dependence was obtained to determine the operating time of the geothermal circulation system in the regime of constant and falling temperatures. It has been established that for a thickness of the layer H <4 m, the influence of heat influxes at = 0.99 and = 0.5 is practically the same, but for a thickness of the layer H> 5 m, the influence of heat inflows depends significantly on temperature. At a thickness of the permeable formation H> 20 m, the heat transfer at = 0.99 has virtually no effect on the thermal processes in the permeable formation, but at = 0.5 the heat influx, depending on the speed of movement, can be from 50 to 90%. Only at H> 50 m, the effect of heat influx significantly decreases and amounts, depending on the filtration rate, from 50 to 10%. The thermal effect of the rock mass with its thickness of more than 10 m, the distance between the discharge circuit and operation, as well as the speed of the coolant have almost no effect on the determination of the operating time of the GCS in constant temperature mode. During operation of the GCS at a dimensionless coolant temperature = 0.5, the velocity of the coolant is significant. With an increase in the speed of the coolant in two times, the error changes by 1.5 times.


Author(s):  
Re-Long Chiu ◽  
Jason Higgins ◽  
Toby Kinder ◽  
Juha Tyni ◽  
Sharon Ying ◽  
...  

Abstract High contact resistance can be caused by moisture absorption in low phosphorus content BPTEOS. Moisture diffused through the TiN glue layer is absorbed by the BPTEOS during subsequent thermal processes resulting in increased contact resistance. This failure mode was studied by combining different failure analysis methods and was confirmed by duplication on experimental wafers.


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