The role of the geometry of crystallographic slip systems in fatigue crack propagation Hong, S.I. and Kwon, H. J. Korean Inst. Metals Mater. (1995) 33 (5), 627–632

1997 ◽  
Vol 19 (5) ◽  
pp. 440
1975 ◽  
Vol 97 (4) ◽  
pp. 289-297 ◽  
Author(s):  
B. Tomkins

The value of modelling the fatigue crack propagation process is discussed and current models are examined in the light of increasing knowledge of crack tip deformation. Elevated temperature fatigue is examined in detail as an area in which models could contribute significantly to engineering design. A model is developed which examines the role of time-dependent creep cavitation on the failure process in an interactive creep-fatigue situation.


2013 ◽  
Vol 592-593 ◽  
pp. 393-396 ◽  
Author(s):  
Ulrich Krupp ◽  
Alexander Giertler ◽  
Stefanie Siegfanz ◽  
Wilhelm Michels

Specimens of the common cast alloy Al-7Si-0.3Mg (A356) were solution heat treated at different temperatures and times to modify (i) the precipitation strengthening effect in the aluminum solid solution phase and (ii) to spheroidize the eutectic silicon. Just 15 minutes of solution heat treatment at a temperature of 540°C are sufficient to reach the desired effect. Cyclic loading experiments revealed an increase in fatigue life as compared to specimens heat treated at lower temperatures. In particular in the HCF regime, fatigue cracks that were originally initiated at pores follow crystallographic slip bands under shear control (mode II) as it was proven by automated EBSD (electron back scatter diffraction) measurements. The smoothly polished surface of the fatigue specimens was observed continuously by a long-distance microscope and discontinuously by SEM (scanning electron microscopy) to identify the fatigue crack propagation mechanisms. It was shown that da/dN decreases strongly when the crack tip interacts with the eutectic areas. Obviously, the blocking effect of the eutectic silicon particles makes the crack leaving the straight slip-band path.


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