2012 13th International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications

TOTAL DOCUMENTS

369

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467316811, 9781467316828, 9781467316804

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Implement of a 3D stacked module using edge-interconnect

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474574 ◽

2012 ◽

Cited By ~ 1

Author(s):

Xiongbo Zhao ◽

Penglong Jiang ◽

Liangliang Liu

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Optimized design of signal crosstalk in high speed PCB

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474678 ◽

2012 ◽

Author(s):

Wenchao Tian ◽

Lei Shan ◽

Wenlong Wang ◽

Yadi Zhu

Keyword(s):

High Speed ◽

Optimized Design ◽

Signal Crosstalk

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Interfacial delamination and reliability design of exposed pad packages

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474688 ◽

2012 ◽

Cited By ~ 1

Author(s):

Guofeng Xia ◽

Fei Qin ◽

Wenhui Zhu ◽

Cha Gao ◽

Xiaobo Ma

Keyword(s):

Reliability Design ◽

Interfacial Delamination

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Effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474843 ◽

2012 ◽

Author(s):

Chao Li ◽

Anmin Hu ◽

Ming Li ◽

Jiangyan Sun

Keyword(s):

Barrier Layer

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Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474737 ◽

2012 ◽

Author(s):

Xiaohui Wang ◽

Mingliang Huang ◽

Fan Yang ◽

Ning Zhao

Keyword(s):

Solder Joints ◽

Layer Growth

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Low-temperature sintering of nanoscale silver paste for double-sided attaching 9×9 mm2 chip

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474608 ◽

2012 ◽

Cited By ~ 1

Author(s):

Jiaoyuan Lian ◽

Yunhui Mei ◽

Xu Chen ◽

Xin Li ◽

Gang Chen ◽

...

Keyword(s):

Low Temperature ◽

Low Temperature Sintering ◽

Silver Paste

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Thermal measurement method for multi-chip packages

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474585 ◽

2012 ◽

Author(s):

Goo Fu Tat ◽

Lee Han Meng Eugene Lee ◽

Gee Kok Peng

Keyword(s):

Measurement Method ◽

Thermal Measurement

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Ultra thin die assembly process for high power RF applications

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474656 ◽

2012 ◽

Author(s):

M. Asis ◽

A. Xiao ◽

E. Del Rosario ◽

F. Rabe ◽

H. Thoonen

Keyword(s):

High Power ◽

Assembly Process ◽

Rf Applications

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Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474649 ◽

2012 ◽

Author(s):

Xiaoying Liu ◽

Mingliang Huang ◽

Ning Zhao

Keyword(s):

Mechanical Properties ◽

Microstructure Formation

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Environmental reliability of nano-structured polymer-metal composite thermal interface material

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474850 ◽

2012 ◽

Cited By ~ 2

Author(s):

Xiuzhen Lu ◽

Mengke Zhuang ◽

Lei Zhang ◽

Lilei Ye ◽

Johan Liu

Keyword(s):

Thermal Interface Material ◽

Metal Composite ◽

Thermal Interface ◽

Polymer Metal

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2012 13th International Conference on Electronic Packaging Technology & High Density PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Implement of a 3D stacked module using edge-interconnect

Optimized design of signal crosstalk in high speed PCB

Interfacial delamination and reliability design of exposed pad packages

Effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution

Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow

Low-temperature sintering of nanoscale silver paste for double-sided attaching 9×9 mm2 chip

Thermal measurement method for multi-chip packages

Ultra thin die assembly process for high power RF applications

Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder

Environmental reliability of nano-structured polymer-metal composite thermal interface material

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications