scholarly journals Development of Pulse Magnetization System on Aberration Corrected 1.2-MV Cold Field-Emission Transmission Electron Microscope

2016 ◽  
Vol 22 (S3) ◽  
pp. 1702-1703 ◽  
Author(s):  
Toshiaki Tanigaki ◽  
Tetsuya Akashi ◽  
Akira Sugawara ◽  
Kodai Niitsu ◽  
Xiuzhen Yu ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Transmission Electron Microscope ◽  
Pulse Magnetization ◽  
Transmission Electron ◽  
Aberration Corrected

Aberration corrected 1.2-MV cold field-emission transmission electron microscope with a sub-50-pm resolution

2015 ◽  
Vol 106 (7) ◽  
pp. 074101 ◽  
Author(s):  
Tetsuya Akashi ◽  
Yoshio Takahashi ◽  
Toshiaki Tanigaki ◽  
Tomokazu Shimakura ◽  
Takeshi Kawasaki ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Transmission Electron Microscope ◽  
Transmission Electron ◽  
Aberration Corrected

scholarly journals Resolution Assessment of an Aberration Corrected 1.2-MV Field Emission Transmission Electron Microscope

2015 ◽  
Vol 21 (S3) ◽  
pp. 1865-1866 ◽  
Author(s):  
Yoshio Takahashi ◽  
Tetsuya Akashi ◽  
Tomokazu Shimakura ◽  
Toshiaki Tanigaki ◽  
Takeshi Kawasaki ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Transmission Electron Microscope ◽  
Transmission Electron ◽  
Aberration Corrected

scholarly journals Development of an Aberration Corrected 1.2-MV Field Emission Transmission Electron Microscope

2015 ◽  
Vol 21 (S3) ◽  
pp. 1597-1598
Author(s):  
Hiroyuki Shinada ◽  
Toshiaki Tanigaki ◽  
Tetsuya Akashi ◽  
Yoshio Takahashi ◽  
Tadao Furutsu ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Transmission Electron Microscope ◽  
Transmission Electron ◽  
Aberration Corrected

Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

2009 ◽  
Vol 24 (8) ◽  
pp. 2638-2643 ◽  
Author(s):  
Kai-Jheng Wang ◽  
Yan-Zuo Tsai ◽  
Jenq-Gong Duh ◽  
Toung-Yi Shih
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Formation Mechanism ◽  
Transmission Electron Microscope ◽  
Electron Probe ◽  
Under Bump Metallization ◽  
Rich Phase ◽  
Snagcu Solder ◽  
Electron Probe Microanalyzer ◽  
Transmission Electron

An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed compositions and microstructure in Sn–Ag–Cu and Ti/Ni(V)/Cu joints were analyzed by a field emission electron probe microanalyzer (EPMA) and transmission electron microscope (TEM), respectively. There existed a concentration redistribution in the Sn-patch, and its microstructure also varied with aging. The Sn-patch consisted of crystalline Ni and an amorphous Sn-rich phase after reflow, whereas V2Sn3 formed with amorphous an Sn-rich phase during aging. A possible formation mechanism of the Sn-patch was proposed.

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