Combining FIB and Automated Microcleaving Provides Fast, Accurate Cross Sections
Keyword(s):
A large part of the preparation of semiconductor samples for SEM and TEM observations involves the creation of cross sections to expose subsurface defects and three-dimensional structure. A powerful new combination of FIB (FEI Company, Hillsboro, Oregon, http://www.feic.com ) with automated microcleaving technology (SELA, Santa Clara, California, http://www. sela.com ) now offers a comprehensive solution for fast, easy and accurate sample preparation.
1996 ◽
Vol 133
(3)
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pp. 571-583
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2010 ◽
Vol 72
(5)
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pp. 313-314
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1987 ◽
Vol 45
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pp. 650-651
1987 ◽
Vol 45
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pp. 633-635
1990 ◽
Vol 48
(1)
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pp. 282-283