Intrinsically heat-sealable polyimides with atomic oxygen (AO) resistance (ARPIs) were synthesized from 2,3,3′,4′-oxydiphthalic anhydride (aODPA), 2,5-bis[(4-aminophenoxy)phenyl]diphenylphosphine oxide (BADPO), and para-phenylenediamine (PDA). The effects of the molecular structure and diamine ratio were investigated on the properties of the ARPI, including mechanical property, thermal property, heat sealability, and AO resistance. Heat sealability and AO resistance were realized for the ARPI film by combining the asymmetry of the aODPA moiety and the passivated layer forming characteristic of diphenylphosphine phosphine oxide group. Meanwhile, the deficiency of low mechanical strength and thermal resistance, commonly existing in a completely BADPO-derived polyimide system, was remedied effectively by the higher reactivity and rigidity of PDA.
