AbstractThis article is devoted to recent progress in the area of in situ electron microscopy (scanning and transmission) and will focus on quantitative aspects of these techniques as applied to the deformation of materials. Selected recent experiments are chosen to illustrate how these techniques have benefited from improvements ranging from sample preparation to digital image acquisition. Known for its ability to capture the underlying phenomena of plastic deformation as they occur, in situ electron microscopy has evolved to a level where fully instrumented micro- and nanomechanical tests can be performed simultaneously.
Strengthening Brittle Semiconductor Nanowires through Stacking Faults: Insights from in Situ Mechanical Testing
