Discussion of the Crack Face Electric Boundary Condition in Piezoelectric Fracture Mechanics

2003 ◽  
Vol 123 (1/2) ◽  
pp. L151-L155 ◽  
Author(s):  
Z.C. Ou ◽  
Y.H. Chen
Author(s):  
MingHao Zhao ◽  
XinFei Li ◽  
Chunsheng Lu ◽  
QiaoYun Zhang

In this paper, taking the exact electric boundary conditions into account, we propose a double iteration method to analyze a crack problem in a two-dimensional piezoelectric semiconductor. The method consists of a nested loop process with internal and outside circulations. In the former, the electric field and electron density in governing equations are constantly modified with the fixed boundary conditions on crack face and the crack opening displacement; while in the latter, the boundary conditions on crack face and the crack opening displacement are modified. Such a method is verified by numerically analyzing a crack with an impermeable electric boundary condition. It is shown that the electric boundary condition on crack face largely affects the electric displacement intensity factor near a crack tip in piezoelectric semiconductors. Under exact crack boundary conditions, the variation tendency of the electric displacement intensity factor versus crack size is quite different from that under an impermeable boundary condition. Thus, exact crack boundary conditions should be adopted in analysis of crack problems in a piezoelectric semiconductor.


Author(s):  
Yu Xu ◽  
Kuao-John Young

Small size longitudinal holes are common in components of high pressure vessels. In fracture mechanics evaluation, longitudinal holes have not drawn as much attention as cross-bores. However, longitudinal holes become critical at certain locations for such assessments because of high stress concentration and short distance to vessel component wall. The high stress concentration can be attributed to three parts: global hoop stress that is magnified by the existence of the hole, local stresses due to pressure in the hole, and crack face pressure. In high pressure vessel design, axisymmetric models are used extensively in stress analyses, and their results are subsequently employed to identify critical locations for fracture mechanics evaluation. However, axisymmetric models ignore longitudinal holes and therefore cannot be used to identify the critical location inside the holes. This paper is intended to highlight the importance of including longitudinal holes in fracture mechanics evaluation, and to present a quick and effective way of evaluating high stress concentration at a longitudinal hole using the combined analytical solutions and axisymmetric stress analysis results, identifying critical locations and conducting fracture mechanics evaluation.


2006 ◽  
Vol 324-325 ◽  
pp. 247-250
Author(s):  
Shu Hong Liu ◽  
Meng Wu ◽  
Shu Min Duan ◽  
Hong Jun Wang

A two-dimensional electromechanical analysis is performed on a transversely isotropic piezoelectric material containing a crack based on the impermeable electric boundary condition. By introducing stress function, a general solution is provided in terms of triangle series. It is shown that the stress and electric displacement are all of 1/2 order singularity in front of the crack tip. In addition, the electromechanical fields in the vicinity of the crack when subjected to uniform tensile mechanical load are obtained using boundary collocation method.


Author(s):  
P. J. Withers

To better understand the relationship between the nucleation and growth of defects and the local stresses and phase changes that cause them, we need both imaging and stress mapping. Here, we explore how this can be achieved by bringing together synchrotron X-ray diffraction and tomographic imaging. Conventionally, these are undertaken on separate synchrotron beamlines; however, instruments capable of both imaging and diffraction are beginning to emerge, such as ID15 at the European Synchrotron Radiation Facility and JEEP at the Diamond Light Source. This review explores the concept of three-dimensional crack-tip X-ray microscopy, bringing them together to probe the crack-tip behaviour under realistic environmental and loading conditions and to extract quantitative fracture mechanics information about the local crack-tip environment. X-ray diffraction provides information about the crack-tip stress field, phase transformations, plastic zone and crack-face tractions and forces. Time-lapse CT, besides providing information about the three-dimensional nature of the crack and its local growth rate, can also provide information as to the activation of extrinsic toughening mechanisms such as crack deflection, crack-tip zone shielding, crack bridging and crack closure. It is shown how crack-tip microscopy allows a quantitative measure of the crack-tip driving force via the stress intensity factor or the crack-tip opening displacement. Finally, further opportunities for synchrotron X-ray microscopy are explored.


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