Hierarchical nanotubular titanium nitride derived from natural cellulose substance and its electrochemical properties

2012 ◽  
Vol 48 (80) ◽  
pp. 9992 ◽  
Author(s):  
Xiaoyan Liu ◽  
Yanhua Zhang ◽  
Tao Wu ◽  
Jianguo Huang
Keyword(s):  
Titanium Nitride ◽  
Electrochemical Properties ◽  
Natural Cellulose

Effects of oxygen on the electrical and electrochemical properties of ion-plated titanium nitride

1992 ◽  
Vol 14 (5-6) ◽  
pp. 313-317 ◽  
Author(s):  
R.T. Carson ◽  
J.H. Givens ◽  
H.S. Savage ◽  
Y.W. Lee ◽  
J.M. Rigsbee ◽  
...  
Keyword(s):  
Titanium Nitride ◽  
Electrochemical Properties

scholarly journals Electrochemical properties of titanium nitride nerve stimulation electrodes: an in vitro and in vivo study

2015 ◽  
Vol 9 ◽  
Author(s):  
Suzan Meijs ◽  
Morten Fjorback ◽  
Carina Jensen ◽  
Søren Sørensen ◽  
Kristian Rechendorff ◽  
...  
Keyword(s):  
Titanium Nitride ◽  
Electrochemical Properties ◽  
Nerve Stimulation ◽  
In Vivo Study

Evolution of the microstructure of Cu(Ti)/SiO2 layers annealed in NH3

1995 ◽  
Vol 53 ◽  
pp. 452-453
Author(s):  
J. Liu ◽  
N. D. Theodore ◽  
D. Adams ◽  
S. Russell ◽  
T. L. Alford ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Titanium Nitride ◽  
Large Scale ◽  
Standard Procedure ◽  
Alloy Film ◽  
Electron Beam Evaporation ◽  
Copper Metallization ◽  
Nominal Composition ◽  
Ti Alloy ◽  
Thermally Grown

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.

GLANCING INCIDENCE X-RAY STUDIES OF TITANIUM NITRIDE THIN FILMS USING A NEW MULTIPURPOSE LABORATORY SPECTROMETER

1989 ◽  
Vol 50 (C7) ◽  
pp. C7-169-C7-173
Author(s):  
R.C BUSCHERT ◽  
P. N. GIBSON ◽  
W. GISSLER ◽  
J. HAUPT ◽  
T. A. CRABB
Keyword(s):  
Thin Films ◽  
Titanium Nitride ◽  
X Ray

Tribotechnical Characteristics of Titanium Nitride Coating for Heavy-Duty Friction Clutches.

1980 ◽  
Vol 41 (5) ◽  
pp. 558-566
Author(s):  
O. Yu Elagina ◽  
◽  
D.O. Kolbas ◽  
A.G. Buklakov ◽  
N. Derr ◽  
...  
Keyword(s):  
Titanium Nitride ◽  
Nitride Coating ◽  
Heavy Duty ◽  
Titanium Nitride Coating ◽  
Tribotechnical Characteristics
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