Thermogravimetric investigation on the interaction of formic acid with solder joint materials
2016 ◽
Vol 40
(12)
◽
pp. 10482-10487
◽
Keyword(s):
Cu Alloy
◽
Reaction mechanisms of gaseous formic acid with oxidized Cu and Sn–Ag–Cu alloy (SAC305) are investigated in the temperature range of soldering (40–260 °C).
Keyword(s):
2009 ◽
Vol 113
(7)
◽
pp. 2873-2880
◽
1979 ◽
Vol 34
(2)
◽
pp. 160-162
◽
Keyword(s):
2021 ◽
Vol 28
(5)
◽
pp. 1661-1668
1996 ◽
Vol 228
(3-4)
◽
pp. 337-341
◽
1990 ◽
Vol 5
(7)
◽
pp. 1388-1391
◽
Keyword(s):