Heat dissipative mechanical damping properties of EPDM rubber composites including hybrid fillers of aluminium nitride and boron nitride

Soft Matter ◽  
2020 ◽  
Vol 16 (29) ◽  
pp. 6812-6818 ◽  
Author(s):  
Jung Keun Cho ◽  
Hanna Sun ◽  
Hee Won Seo ◽  
June-Young Chung ◽  
Mina Seol ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Electronic Devices ◽  
Damping Properties ◽  
Critical Factors ◽  
Rubber Composites ◽  
Epdm Rubber ◽  
Hybrid Fillers ◽  
Automotive Parts ◽  
Mechanical Damping

As highly integrated electronic devices and automotive parts are becoming used in high-power and load-bearing systems, thermal conductivity and mechanical damping properties have become critical factors, which could be enhanced by the composites with the different-shaped hybrid fillers.

scholarly journals Improved Thermal Conductivity of Styrene Acrylic Resin with Carbon Nanotubes, Graphene and Boron Nitride hybrid fillers

2021 ◽  
Author(s):  
Fuhua Jia ◽  
Emmanuel Oluwaseyi Fagbohun ◽  
Qianyu Wang ◽  
Duoyin Zhu ◽  
Jianling Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Boron Nitride ◽  
Acrylic Resin ◽  
Hybrid Fillers

Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Electronic Devices ◽  
E Coli ◽  
Thermally Conductive ◽  
Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

scholarly journals Hybrid fillers of hexagonal and cubic boron nitride in epoxy composites for thermal management applications

RSC Advances ◽  
2019 ◽  
Vol 9 (13) ◽  
pp. 7388-7399 ◽  
Author(s):  
Yuyuan Zhang ◽  
Wei Gao ◽  
Yujing Li ◽  
Dehe Zhao ◽  
Hong Yin
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Synergistic Effect ◽  
Thermal Management ◽  
Cubic Boron Nitride ◽  
Polymeric Composites ◽  
Epoxy Composites ◽  
Hybrid Fillers

The synergistic effect of h-BN/c-BN/EP on the enhancement of thermal conductivity of polymeric composites has been demonstrated.

scholarly journals Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3634
Author(s):  
John M. Hutchinson ◽  
Sasan Moradi
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Filler Content ◽  
Electronic Devices ◽  
Cure Kinetics ◽  
The Matrix ◽  
Thermally Conductive ◽  
Filler Particles ◽  
Kinetics Of

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

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