Preparation of micron-scale Cu@Ag conductive particles by displacement coating to reinforce epoxy conductive adhesives
Keyword(s):
The epoxy resin conductive adhesives with high electrical conductivity were prepared by adding a simple coating of well-dispersed micron-scale silver-coated copper(Cu@Ag)particles. The Cu@Ag particles were prepared by displacement coating using...
2007 ◽
Vol 353-358
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pp. 2879-2882
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2020 ◽
Vol 820
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pp. 153184
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2021 ◽
pp. 102988
2000 ◽
Vol 30
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pp. 535-537
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