Into the third dimension [vertical integration]

2007 ◽  
Vol 5 (6) ◽  
pp. 10-11
Author(s):  
L. Collins
Keyword(s):  
Vertical Integration ◽  
The Third ◽  
Third Dimension

IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION

2019 ◽  
Vol 2019 (1) ◽  
pp. 000260-000267
Author(s):  
Woo Han Young ◽  
Mike Marshall
Keyword(s):  
Process Control ◽  
Vertical Integration ◽  
High Speed ◽  
Process Development ◽  
Defect Inspection ◽  
Statistical Process ◽  
The Third ◽  
Advanced Packaging ◽  
Third Dimension ◽  
3D Metrology

Abstract Die sizes continue to shrink and packaging technologies continue to evolve, but the common thread for all of them is the need for increased precision and tighter process control limits to achieve final package yield. Nearly all packaging technologies require connections in the third dimension, above or below the die, thus adding, quite literally, a new dimension to inspection and metrology requirements. Increased focus on reliability for automotive, health care and even mobile electronics is driving the need for improved process control solutions. The combination of higher packaging complexity and the need for improved reliability are driving changes to the requirements around inspection and metrology. Vertical integration continues to grow at a pervasive rate and the need for improved process control in the third dimension is growing rapidly in order to ensure reliability. Vertical integration is designed into nearly all packaging forms, including TSV, RDL, WLP, Fan-in, Fan-out, with a focus on continued increase in the number of I/Os, the pitch of features (RDL and bump) and the overall package size increasing. This integration drives the need for 3D metrology of feature height and coplanarity. In addition, the need to augment raw 3D metrology with defect inspection and 2D metrology data enables a comprehensive view (insight) into the packaging process. Achieve total bump process control with the combination of data from: (1) 2D defect detection – voids and shorts, foreign material, misprocessing; (2) 2D metrology – bump diameter, bump position, bump presence; (3) 3D inspection – bump too tall, bump too short, statistical process control (SPC); (4) Auto classifications – data must make sense and be easy to interpret. By combining high speed 2D, 3D metrology with defect inspection and advanced analytics, the quality of process control data can be exponentially improved to enable quick time-to-results for both process development and HVM control. This paper describes the inspection and metrology challenges of bumps in advanced packaging and the next generation high-throughput bump inspection methodology for wafers with extremely high bump counts as well as the data analysis

Adding the Third Dimension to High Resolution MR-Imaging of the Inner Ear: An Answer waiting for a question

2013 ◽  
Vol 185 (S 01) ◽  
Author(s):  
NN Naguib ◽  
NE Nour-Eldin ◽  
T Gruber-Rouh ◽  
T Lehnert ◽  
R Hammerstingl ◽  
...  
Keyword(s):  
High Resolution ◽  
Mr Imaging ◽  
Inner Ear ◽  
The Third ◽  
Third Dimension

Taking Cell Culture in Drug Discovery to the Third Dimension - A Patent Review

2008 ◽  
Vol 1 (2) ◽  
pp. 103-115
Author(s):  
Yinzhi Lai ◽  
Lina Wang ◽  
Ke Cheng ◽  
William Kisaalita
Keyword(s):  
Cell Culture ◽  
Drug Discovery ◽  
The Third ◽  
Patent Review ◽  
Third Dimension

La troisième dimension — De la fonction éthique et esthétique du décor dans le théâtre de machines français du XVIIe siècle

2020 ◽  
Vol 71 (1) ◽  
pp. 130-168
Author(s):  
Kirsten Dickhaut
Keyword(s):  
Seventeenth Century ◽  
Character Traits ◽  
Optical Illusion ◽  
Stage Design ◽  
The Third ◽  
Adequate Representation ◽  
Third Dimension ◽  
Xviie Siecle ◽  
The Aesthetic

AbstractThe machine theatre in France achieves its peak in the second half of the seventeenth century. It is the construction of machines that permits the adequate representation of the third dimension on stage. This optical illusion is created by flying characters, as heroes, gods, or demons moving horizontally and vertically. The enumeration indicates that only characters possessing either ethically exemplary character traits or incorporating sin are allowed to fly. Therefore, the third dimension indicates bienséance – or its opposite. According to this, the following thesis is deduced: The machine theatre illustrates via aesthetic concerns characterising its third dimension an ethic foundation. Ethic and aesthetics determine each other in the context of both, decorum and in theatre practice. In order to prove this thesis three steps are taken. First of all, the machine theatre’s relationship to imitation and creation is explored. Second, the stage design, representing the aesthetic benefits of the machines in service of the third dimension, are explained. Finally, the concrete example of Pierre Corneille’s Andromède is analysed by pointing out the role of Pegasus and Perseus.

Extending molecular systematics to the third dimension

1996 ◽  
Vol 3 (7) ◽  
pp. 575-578 ◽  
Author(s):  
Shoshana J. Wodak
Keyword(s):  
Molecular Systematics ◽  
The Third ◽  
Third Dimension
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