Recovery of Phosphorus from Waste Solution of Electroless Nickel-Phosphorus Plating

We attempted to recover phosphorus species from a waste plating solution of electroless nickel-phosphorus plating. With the aim of increasing the recovery yield by oxidizing phosphite to phosphate efficiently, we examined ozonation of a model plating solution by supplying ozonecontaining oxygen gas to the solution employing an aerated mixing vessel. As a result of the measurements of the transient changes in the concentrations of the phosphorus species and dissolved ozone in the solution, we confirmed the effect of the organic additives contained in the plating solution on the ozonation efficiency. Calcium chloride was subsequently added to the ozone-treated solution to precipitate the phosphate as calcium hydrogen phosphate, which was poorly soluble to water. At this moment, the recovery yield of the phosphorus from the model waste plating solution was greater than 86%.

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Facile Synthesis of Hydroxyapatite Nanorods with Controlled Sizes and Morphologies

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.148-149.1584 ◽

2010 ◽

Vol 148-149 ◽

pp. 1584-1587

Author(s):

Sha Sha Lv ◽

Ning Wang ◽

Gui Cun Li ◽

Hong Rui Peng

Keyword(s):

Hydrothermal Method ◽

Calcium Chloride ◽

Hydrogen Phosphate ◽

Facile Synthesis ◽

High Quality ◽

Facile Hydrothermal Method ◽

Diammonium Hydrogen Phosphate ◽

Diammonium Hydrogen

High quality hydroxyapatite (HAP) nanorods have been synthesized at 180 °C by a facile hydrothermal method using calcium chloride and diammonium hydrogen phosphate as precursors in the absence of any surfactants. The diameters and lengths of HAP nanorods are in the range of 40-80 nm and 0.2-2.0 μm respectively. The sizes and morphologies of HAP nanorods can be controlled by adjusting the synthetic parameters, such as reaction temperatures, and types of surfactants. A possible mechanism was also proposed to explain the growth of the HAP nanorods.

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Studies on Composition of Caustic Alkaline Electroless Nickel Plating Solution

Journal of the Metal Finishing Society of Japan ◽

10.4139/sfj1950.15.135 ◽

1964 ◽

Vol 15 (4) ◽

pp. 135-138

Author(s):

Satoru ISHIBASHI ◽

Osamu TAKANO ◽

Masaoki YOSHIDA ◽

Tooru SHIMIZU

Keyword(s):

Electroless Nickel ◽

Electroless Nickel Plating ◽

Nickel Plating ◽

Plating Solution

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Relation between Nickel Plating Speed and Concentration of Ammonia in Ammoniacal Electroless Nickel Plating Solution

Journal of the Metal Finishing Society of Japan ◽

10.4139/sfj1950.13.307 ◽

1962 ◽

Vol 13 (7) ◽

pp. 307-310

Author(s):

Satoru ISHIBASHI ◽

Norio TEZUKA ◽

Isao KANBARA

Keyword(s):

Electroless Nickel ◽

Electroless Nickel Plating ◽

Nickel Plating ◽

Plating Solution

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Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.26-28.637 ◽

2007 ◽

Vol 26-28 ◽

pp. 637-640 ◽

Cited By ~ 1

Author(s):

Yoo Min Ahn ◽

Yong Jun Ko ◽

Hyun Joon Kim ◽

Dong Ho Lee ◽

Su Kei Lee ◽

...

Keyword(s):

Mechanical Properties ◽

Residual Stress ◽

Silicon Oxide ◽

Copper Film ◽

Organic Additives ◽

Electro Deposition ◽

Cu Film ◽

Plating Solution ◽

Electroplated Copper ◽

Copper Structure

This paper discusses the effect of plating condition on the mechanical properties and residual stress of electroplated Cu film. The inlaid copper structure was fabricated on silicon wafer where silicon oxide was thermally grown. Seed layer was deposited by sputtering method followed by copper electro-deposition. Copper was electrodeposited with IBM paddle type electroplating machine Residual stress, hardness, elastic modulus, and surface roughness of electroplated copper film were investigated at various organic additives in plating solution and current types with a nanoindenter and a surface profilometer. The dishing amounts in chemical mechanical polishing (CMP) was also investigated at various additives. The results show that, in the case of residual stress, the copper film deposited at higher additive or PC current result in lower residual stress. The additives do not significantly affect the mechanical properties of Cu deposit.

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