Experimental Evaluation of the Effect of Two Different Types of Drywall Joint Compound on Shear Capacity of Wood-Frame Walls

AEI 2008 ◽  
2008 ◽  
Author(s):  
Ali M. Memari ◽  
Matt Sambol
2019 ◽  
Vol 282 ◽  
pp. 02050
Author(s):  
Michael A. Lacasse ◽  
Nathan Van Den Bossche ◽  
Stephanie Van Linden ◽  
Travis V. Moore

There is an increase in the use of hygrothermal models to complete the performance evaluation of walls assemblies, either in respect to design of new assembles or the retrofit of existing wall assemblies. To this end there are guides available in which is provided information on moisture loads to wall assemblies. This includes, for example, Criteria for Moisture-Control Design Analysis in Buildings given in ASHRAE 160, Assessment of moisture transfer by numerical simulation provided in EN 15026, and NRC’s “Guidelines for Design for Durability of the Building Envelope”. The designer of a new assembly or evaluator of an existing wall is tasked with having to determine what moisture loads to apply to the wall and where to apply this load within the assembly. Typically there is little or no information that is readily available regarding moisture loads to walls and thus the suggested hourly moisture load, as given in ASHRAE 160, is 1% by weight of the total driving rain load to the wall (i.e. kg/m2-hr). In this paper, a brief compendium of water entry test results derived from laboratory tests of various types of wall assemblies is provided from which estimates of moisture loads to different types of wall can be developed. Water entry test results are given of wood frame walls typically used in housing, but also metal-glass curtain walls and other commercial wall assemblies, where possible, in terms of driving loads to the wall.


2015 ◽  
Vol 87 ◽  
pp. 930-940 ◽  
Author(s):  
Yanbin Zhang ◽  
Changhe Li ◽  
Dongzhou Jia ◽  
Dongkun Zhang ◽  
Xiaowei Zhang

Structures ◽  
2020 ◽  
Vol 28 ◽  
pp. 1173-1186
Author(s):  
Minh Hai Nguyen ◽  
Yuma Hirano ◽  
Akinori Nakajima ◽  
Shuichi Fujikura ◽  
Ryo Niimura

2019 ◽  
Vol 6 (6) ◽  
pp. 066575 ◽  
Author(s):  
Xie Hongmei ◽  
Jiang Bin ◽  
Tang Changping ◽  
Dai Jiahong ◽  
Quan Xin ◽  
...  

2015 ◽  
Vol 7 (3-4) ◽  
pp. 261-270 ◽  
Author(s):  
Václav Valenta ◽  
Thomas Spreng ◽  
Shuai Yuan ◽  
Wolfgang Winkler ◽  
Volker Ziegler ◽  
...  

Different types of bondwire interconnect for differential chip-to-antenna and single-ended chip-to-chip interfaces are investigated. Two differential compensation structures for various lengths of interconnects are designed and experimentally evaluated using dedicated transmit and receive radar modules operating across a 110–156 GHz band. Measurement results demonstrate that a fractional bandwidth of 7.5% and a minimum insertion loss of 0.2 dB can be achieved for differential interconnects as long as 0.8 mm. Design and measurement results of an extremely wideband low-loss single-ended chip-to-chip bondwire interconnect that features 1.5 dB bandwidth from DC to 170 GHz and insertion loss of less than 1 dB at 140 GHz are presented as well. The results show that the well-established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility and scalability of the proposed solutions are assessed as well.


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