scholarly journals Design and experimental evaluation of compensated bondwire interconnects above 100 GHz

2015 ◽  
Vol 7 (3-4) ◽  
pp. 261-270 ◽  
Author(s):  
Václav Valenta ◽  
Thomas Spreng ◽  
Shuai Yuan ◽  
Wolfgang Winkler ◽  
Volker Ziegler ◽  
...  

Different types of bondwire interconnect for differential chip-to-antenna and single-ended chip-to-chip interfaces are investigated. Two differential compensation structures for various lengths of interconnects are designed and experimentally evaluated using dedicated transmit and receive radar modules operating across a 110–156 GHz band. Measurement results demonstrate that a fractional bandwidth of 7.5% and a minimum insertion loss of 0.2 dB can be achieved for differential interconnects as long as 0.8 mm. Design and measurement results of an extremely wideband low-loss single-ended chip-to-chip bondwire interconnect that features 1.5 dB bandwidth from DC to 170 GHz and insertion loss of less than 1 dB at 140 GHz are presented as well. The results show that the well-established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility and scalability of the proposed solutions are assessed as well.

2021 ◽  
Vol 9 ◽  
Author(s):  
Zixian Wu ◽  
Guanghua Shi ◽  
Yang Yu ◽  
Xiaozhu Wen ◽  
Cheng Guo ◽  
...  

This paper reports the design, fabrication and measurement techniques for a set of low-loss slotted waveguides. The waveguides are fabricated based on a micro metal additive manufacturing technology. They were fabricated layer by layer in one piece without the need of post-fabrication assembly. As examples, straight waveguides in WR-3.4 (220-330°GHz) and WR-2.2 (330-500°GHz) bands were fabricated and tested. Measurement results show the insertion loss per unit length is 0.0615-0.122°dB/mm and 0.116-0.281°dB/mm, respectively.


2021 ◽  
Vol 11 (12) ◽  
pp. 5637
Author(s):  
Peter Kaľavský ◽  
Róbert Rozenberg ◽  
Peter Korba ◽  
Martin Kelemen ◽  
Matej Antoško ◽  
...  

Testing in the field of parachute technology provides space for the application of new and innovative methods of measuring operating and functional parameters. The main aim of the paper is to present the results of research for the verification of the photo-optical method of measuring the vertical speed of the M-282 parachutes, and for its use in testing, collecting, and investigating motion data in parachuting. As part of this measuring technology, twelve jumps were performed. It was verified that the experiment was completed for the M-282 parachute according to the regulation of SAE AS 8015B “Minimum Performance Standard Parachute Assemblies and Components”. An analysis of the influencing factors and quantification of their influence on the uncertainty of the measurement results was also performed. The results of the measurement achieved by using the photo-optical method were compared with the measurement with the electronic variometer FLYTEC 4030. The vertical speed of the M-282 parachute (4.655 m·s−1) defined by the photo-optical method is significantly similar to the vertical speed of the M-282 parachute (4.662 m·s−1) defined by FLYTEC 4030. We can state that the process of identifying the vertical speed of the parachute by the photo-optical method was correct. This is a suitable method of evaluating motion data in the operation of M-282 type parachutes. In the following research for generalization of the methodology, we assume the performance of more than 60 experimental jumps using different types of parachutes, digital sensors (cameras), and a photo-optical method to examine motion data and formulate recommendations for testing, investigative applications, individualized training programs, and aspects of parachuting injury prevention.


2011 ◽  
Vol 308-310 ◽  
pp. 2279-2285
Author(s):  
Wei Chen Lee ◽  
Hill Wu

The electrical characteristics of an interconnection system, which include impedance, insertion loss, and return loss, can greatly affect its performance as the signal speed increases. The objective of this research was to understand the discrepancy between the computer-aided analysis and measurement results of an interconnection system, so that a more accurate prediction of the electrical characteristics of this system can be made during the design phase. It was discovered that in both the time and frequency domain the computer-aided analysis results were consistent with the measurement results. Given these conclusions the simulation model was modified to improve the impedance mismatch within the interconnection system. It was found that by properly designing the antipad, the impedance mismatch can be greatly reduced.


Frequenz ◽  
2018 ◽  
Vol 72 (11-12) ◽  
pp. 533-537 ◽  
Author(s):  
Jin Xu ◽  
Qi-Hang Cai ◽  
Zhi-Yu Chen

Abstract This paper proposes a wideband bandpass filter (BPF) integrated single-pole double-throw (SPDT) switch by using the capacitively coupled LC resonators with loaded p-i-n diodes. The BPF-integrated on-state channel can be synthesized by using the coupled resonator filter theory, and the off-state channel with high suppression is built due to the misaligned resonant frequencies of LC resonators. As an example, a BPF-integrated SPDT switch is designed and fabricated with the central frequency of 1 GHz and the 3 dB fractional bandwidth of 29.7 %. The on-state channel has a measured insertion loss of 1.23 dB, and a 20 dB rejection wide stopband from 1.47 GHz to 8.6 GHz. The off state channel has a 43 dB suppression around 1 GHz. The isolation between two ports is better than 52.4 dB. The fabricated BPF-integrated SPDT switch size including bias circuits but excluding feeding lines has a compact size of 0.086 λg×0.096 λg.


2021 ◽  
Vol 21 (1) ◽  
pp. 1
Author(s):  
Arie Setiawan ◽  
Taufiqqurrachman Taufiqqurrachman ◽  
Adam Kusumah Firdaus ◽  
Fajri Darwis ◽  
Aminuddin Rizal ◽  
...  

Short range radar (SRR) uses the K-band frequency range in its application. The radar requires high-resolution, so the applied frequency is 1 GHz wide. The filter is one of the devices used to ensure only a predetermined frequency is received by the radar system. This device must have a wide operating bandwidth to meet the specification of the radar. In this paper, a band pass filter (BPF) is proposed. It is designed and fabricated on RO4003C substrate using the substrate integrated waveguide (SIW) technique, results in a wide bandwidth at the K-band frequency that centered at 24 GHz. Besides the bandwidth analysis, the analysis of the insertion loss, the return loss, and the dimension are also reported. The simulated results of the bandpass filter are: VSWR of 1.0308, a return loss of -36.9344 dB, and an insertion loss of -0.6695 dB. The measurement results show that the design obtains a VSWR of 2.067, a return loss of -8.136 dB, and an insertion loss of -4.316  dB. While, it is obtained that the bandwidth is reduced by about 50% compared with the simulation. The result differences between simulation and measurement are mainly due to the imperfect fabrication process.


2021 ◽  
Vol 36 (7) ◽  
pp. 865-871
Author(s):  
Jin Shi ◽  
Jiancheng Dong ◽  
Kai Xu ◽  
Lingyan Zhang

A novel miniaturized wideband bandpass filter (BPF) using capacitor-loaded microstrip coupled line is proposed. The capacitors are loaded in parallel and series to the coupled line, which makes the filter just require one one-eighth wavelength coupled line and achieve filtering response with multiple transmission poles (TPs) and transmission zeros (TZs). Compared with the state-of-the-art microstrip wideband BPFs, the proposed filter has the advantages of compact size and simple structure. A prototype centered at 1.47 GHz with the 3-dB fractional bandwidth of 86.5% is demonstrated, which exhibits the compact size of 0.003λ2 g (λg is the guided wavelength at the center frequency) and the minimum insertion loss of 0.37 dB.


2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000067-000072
Author(s):  
Bradley A. Thrasher ◽  
William E. McKinzie ◽  
Deepukumar M. Nair ◽  
Michael A. Smith ◽  
Allan Beikmohamadi ◽  
...  

Presented here are the design, fabrication, and measurement results of a low temperature cofired ceramic (LTCC) chip-to-interposer transition utilizing a flip-chip ball grid array (BGA) interconnect that provides excellent electrical performance up to and including 80 GHz. A test board fabricated in LTCC is used as the interposer substrate and another smaller LTCC part is used as a surrogate chip for demonstration purposes. The BGA chip-to-interposer transition is designed as a back-to-back pair of transitions with an assembly consisting of an LTCC interposer, an LTCC test chip, and a BGA interconnect constructed with 260 μm diameter polymer core solder balls. The LTCC material employed is DuPont™ GreenTape™ 9K7. Full-wave simulation results predict excellent electrical performance from 10 MHz to 80 GHz, with the chip-to-interposer BGA transition having less than 0.5 dB insertion loss at 60 GHz and less than 1 dB insertion loss up to 80 GHz. In an assembled package (back-to-back BGA transitions), the insertion loss was measured to be 1 dB per transition at 60 GHz and less than 2 dB per transition for all frequencies up to 80 GHz.


Electronics ◽  
2020 ◽  
Vol 9 (2) ◽  
pp. 270
Author(s):  
Yi-Fan Tsao ◽  
Joachim Würfl ◽  
Heng-Tung Hsu

In this paper, we propose a new configuration for improving the isolation bandwidth of MMIC single-pole-double-throw (SPDT) passive high-electron-mobility transistor (HEMT) switches operating at millimeter frequency range. While the conventional configuration adopted open-stub loading for compensation of the off-state capacitance, radial stubs were introduced in our approach to improve the operational bandwidth of the SPDT switch. Implemented in 0.15 m GaAs pHEMT technology, the proposed configuration exhibited a measured insertion loss of less than 2.5 dB with better than 30 dB isolation level over the frequency range from 33 GHz to 44 GHz. In terms of the bandwidth of operation, the proposed configuration achieved a fractional bandwidth of 28.5% compared to that of 12.3% for the conventional approach. Such superior bandwidth performance is mainly attributed to the less frequency dependent nature of the radial stubs.


Sensors ◽  
2019 ◽  
Vol 19 (24) ◽  
pp. 5447
Author(s):  
Calvin Yi-Ping Chao ◽  
Shang-Fu Yeh ◽  
Meng-Hsu Wu ◽  
Kuo-Yu Chou ◽  
Honyih Tu ◽  
...  

In this paper we present a systematic approach to sort out different types of random telegraph noises (RTN) in CMOS image sensors (CIS) by examining their dependencies on the transfer gate off-voltage, the reset gate off-voltage, the photodiode integration time, and the sense node charge retention time. Besides the well-known source follower RTN, we have identified the RTN caused by varying photodiode dark current, transfer-gate and reset-gate induced sense node leakage. These four types of RTN and the dark signal shot noises dominate the noise distribution tails of CIS and non-CIS chips under test, either with or without X-ray irradiation. The effect of correlated multiple sampling (CMS) on noise reduction is studied and a theoretical model is developed to account for the measurement results.


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