Transparency of thin metal films on semiconductor substrates

1976 ◽  
Vol 47 (11) ◽  
pp. 4968-4970 ◽  
Author(s):  
H. J. Hovel
Keyword(s):  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Semiconductor Substrates

Electrolytic Deposition of Thin Metal Films on Semiconductor Substrates

1977 ◽  
Vol 124 (7) ◽  
pp. 1012-1018 ◽  
Author(s):  
P. Bindra ◽  
H. Gerischer ◽  
D. M. Kolb
Keyword(s):  
Metal Films ◽  
Thin Metal ◽  
Electrolytic Deposition ◽  
Thin Metal Films ◽  
Semiconductor Substrates

ChemInform Abstract: ELECTROLYTIC DEPOSITION OF THIN METAL FILMS ON SEMICONDUCTOR SUBSTRATES

1977 ◽  
Vol 8 (43) ◽  
pp. no-no
Author(s):  
P. BINDRA ◽  
H. GERISCHER ◽  
D. M. KOLB
Keyword(s):  
Metal Films ◽  
Thin Metal ◽  
Electrolytic Deposition ◽  
Thin Metal Films ◽  
Semiconductor Substrates

Metal Microstructures in Advanced CMOS Devices

1996 ◽  
Vol 54 ◽  
pp. 358-359
Author(s):  
L. M. Gignac ◽  
K. P. Rodbell
Keyword(s):  
Grain Boundaries ◽  
Semiconductor Device ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Metal Films ◽  
Thin Metal ◽  
Electrical Performance ◽  
Thin Metal Films ◽  
Chemical Vapor Deposited ◽  
Boundary Properties

As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.

1/f noise and nonlinear effects in thin metal films

1997 ◽  
Vol 167 (6) ◽  
pp. 623 ◽  
Author(s):  
Gennadii P. Zhigal'skii
Keyword(s):  
Nonlinear Effects ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films

On the electrocatalytic symbiotic synergism between Pt, Ni and Al in plasma vapour deposited PtxNiyAlz thin metal films for water electrolysis

2021 ◽  
Vol 494 ◽  
pp. 229344
Author(s):  
Roelof J. Kriek ◽  
Liesel A. van Heerden ◽  
Anzel Falch ◽  
Malcolm I. Gillespie ◽  
Alaa Y. Faid ◽  
...  
Keyword(s):  
Water Electrolysis ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films

scholarly journals Development on the Tensile Fatigue Test Apparatus and Strength Evaluation of Thin Metal Films

2006 ◽  
Vol 72 (718) ◽  
pp. 880-885 ◽  
Author(s):  
Miyuki FUKUSHI ◽  
Hiroshi MIYATA ◽  
Akira MURAKAMI
Keyword(s):  
Fatigue Test ◽  
Metal Films ◽  
Thin Metal ◽  
Test Apparatus ◽  
Thin Metal Films ◽  
Strength Evaluation ◽  
Tensile Fatigue

Density and defects in thin metal films using x‐ray reflectivity and variable‐energy positrons

1992 ◽  
Vol 72 (10) ◽  
pp. 4669-4673 ◽  
Author(s):  
S. M. Heald ◽  
B. Nielsen
Keyword(s):  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
X Ray ◽  
Variable Energy

Optical Properties of Ultra-thin Metal Films

2006 ◽  
Author(s):  
B. Gompf ◽  
T. Brandt ◽  
J. Beister ◽  
M. Dressel ◽  
N. Drichko
Keyword(s):  
Optical Properties ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films

van der Waals energy of an atom in the proximity of thin metal films

2000 ◽  
Vol 61 (5) ◽  
Author(s):  
M. Boström ◽  
Bo E. Sernelius
Keyword(s):  
Van Der Waals ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films
Sign in / Sign up

Export Citation Format

Share Document