An analytical model of strain isolation for stretchable and flexible electronics

2011 ◽  
Vol 98 (6) ◽  
pp. 061902 ◽  
Author(s):  
H. Cheng ◽  
J. Wu ◽  
M. Li ◽  
D.-H. Kim ◽  
Y.-S. Kim ◽  
...  
2013 ◽  
Vol 278-280 ◽  
pp. 852-855
Author(s):  
Yan Jun Lu ◽  
Hong Bin Zhu ◽  
Yong Fang Zhang ◽  
Di Hei

The prospective application of flexible electronics is feasible by shielding the silicon ribbons from damage in the structure. The silicon failure in the design of strain isolation for stretchable and flexible sensors is analyzed by FEM. The destruction of the silicon circuit is different with the change of the thickness of the PDMS layer in stretchable sensors. Owing to the fact that the PDMS layer is not infinitely thick in the application, the purpose of the paper is to provide a reference for choosing the thickness of the PDMS layer in the design of stretchable sensors.


1988 ◽  
Vol 49 (C8) ◽  
pp. C8-911-C8-912
Author(s):  
Yu. V. Rakitin ◽  
V. T. Kalinnikov
Keyword(s):  

2002 ◽  
Vol 4 (1-2) ◽  
pp. 26
Author(s):  
Paulo Fernando Lavalle Heilbron Filho ◽  
Jesus Salvador Perez Guerrero ◽  
Elizabeth May Pontedeiro ◽  
Nerbe J. Ruperti, Jr. ◽  
Renato M. Cotta

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