scholarly journals The motion of a 3D toroidal bubble and its interaction with a free surface near an inclined boundary

2016 ◽  
Vol 28 (12) ◽  
pp. 122101 ◽  
Author(s):  
Y. L. Liu ◽  
Q. X. Wang ◽  
S. P. Wang ◽  
A. M. Zhang
Keyword(s):  
2021 ◽  
Vol 926 ◽  
Author(s):  
Youssef Saade ◽  
Maziyar Jalaal ◽  
Andrea Prosperetti ◽  
Detlef Lohse

A rapidly growing bubble close to a free surface induces jetting: a central jet protruding outwards and a crown surrounding it at later stages. While the formation mechanism of the central jet is known and documented, that of the crown remains unsettled. We perform axisymmetric simulations of the problem using the free software program BASILISK, where a finite-volume compressible solver has been implemented, which uses a geometric volume-of-fluid (VoF) method for the tracking of the interface. We show that the mechanism of crown formation is a combination of a pressure distortion over the curved interface, inducing flow focusing, and of a flow reversal, caused by the second expansion of the toroidal bubble that drives the crown. The work culminates in a parametric study with the Weber number, the Reynolds number, the pressure ratio and the dimensionless bubble distance to the free surface as control parameters. Their effects on both the central jet and the crown are explored. For high Weber numbers, we observe the formation of weaker ‘secondary crowns’, highly correlated with the third oscillation cycle of the bubble.


2015 ◽  
Vol 109 ◽  
pp. 611-622 ◽  
Author(s):  
Shiping Wang ◽  
Wenyang Duan ◽  
Qianxi Wang
Keyword(s):  

Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


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