Microstructure evolution and phase formation of transient liquid phase Sn/Ag solder alloy via multiple reflow soldering method

2021 ◽  
Author(s):  
N. Saud ◽  
K. F. Ng ◽  
R. Mohd Said
Author(s):  
Wendelin Deibert ◽  
Mariya E. Ivanova ◽  
Yuanye Huang ◽  
Rotraut Merkle ◽  
Joachim Maier ◽  
...  

We show manufacturing of 25 cm2 BZCY half-cells by tape-casting of assemblies with electrolyte thickness 10–20 μm. BaY2NiO5 transient liquid phase formation is analysed and proton conductivity with values of σ = 0.003 S cm−1 at 600 °C is shown.


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