scholarly journals X-ray diffraction by phospholipid monolayers on single-crystal silicon substrates

1983 ◽  
Vol 80 (18) ◽  
pp. 5795-5797 ◽  
Author(s):  
M. Seul ◽  
P. Eisenberger ◽  
H. M. McConnell
2010 ◽  
Vol 25 (2) ◽  
pp. 149-153
Author(s):  
Isaac Vander ◽  
R. W. Zuneska ◽  
F. J. Cadieu

This paper presents a nondestructive measurement technique for the determination of the film thicknesses of Co and SmCo based magnetic films deposited by sputtering on single-crystal silicon (100) substrates. X-ray diffraction of Cu Kα radiation has been used to measure the intensity of the (400) reflection from bare silicon substrates and as attenuated by sputter coated Co and SmCo based films on Si substrates. A four-axis research diffractometer allowed the substrate orientation to be fine adjusted to maximize the (400) diffraction intensity. The thickness of SmCo based films was in a range from 0.05 to 5 μm. Co film thicknesses on Si could be measured to a few tens of nanometers. The accuracy of the thickness measurements depends on the effective mass attenuation coefficient of the film material. For the materials considered, the thicknesses determined by the X-ray attenuation method agree within at least several percent to values determined by other methods.


Author(s):  
М.У. Каланов ◽  
А.В. Хугаев

Thermal oxidation of a silicon single crystal in the temperature range of 293 – 1293 K was studied using high – temperature X – ray diffraction directly on the beam. An anomaly in the intensity and angular position of diffuse scattering from the surface of the single crystal was found. The anomaly is explained by the oxidation of the silicon surface according to the Dill Grove model, including the process of thermal oxidation and sublimation of the oxide layer depending on temperature. It was found that in the bulk of a single crystal (silicon medium) in this temperature range, there is a - b phase transition in the crystalline phase of silicon dioxide, similar to the a - b transition of quartz in the atmosphere.


1994 ◽  
Vol 9 (1) ◽  
pp. 50-53 ◽  
Author(s):  
Benjamin L. Ballard ◽  
Paul K. Predecki ◽  
Camden R. Hubbard

Residual strains and microstresses are evaluated for both phase of a hot-pressed, fine-grained α-alumina reinforced with 25 wt% (29 vol%) single-crystal silicon carbide whiskers at temperatures from 25 to 1000 °C. The sample was maintained in a nonoxidizing environment while measurements of the interplaner spacing of alumina (146) and SiC (511 + 333) were made using X-ray diffraction methods. The residual strains were profiled at temperature increments of 250 °C from which the corresponding microstresses were calculated. Linear extrapolation of the SiC ε33 profile indicates that the strains are completely relaxed at a temperature of approximately 1470 °C. These residual stress relaxation results suggest that elevated temperature toughness and fracture strength of this composite may result from cooperative mechanisms.


1981 ◽  
Vol 25 ◽  
pp. 365-371
Author(s):  
Glen A. Stone

This paper presents a new method to measure the thickness of very thin films on a substrate material using energy dispersive x-ray diffractometry. The method can be used for many film-substrate combinations. The specific application to be presented is the measurement of phosphosilicate glass films on single crystal silicon wafers.


Author(s):  
Raul E. Riveros ◽  
Michael P. Biskach ◽  
Kim D. Allgood ◽  
John D. Kearney ◽  
William W. Zhang ◽  
...  

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