A Numerical Study of the Thermal Performance of Microchannel Heat Sinks with Multiple Length Bifurcation in Laminar Liquid Flow

2013 ◽  
Vol 65 (2) ◽  
pp. 107-126 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang ◽  
Haibin Li
Keyword(s):  
Thermal Performance ◽  
Liquid Flow ◽  
Numerical Study ◽  
Heat Sinks ◽  
Microchannel Heat Sinks

scholarly journals Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes

Entropy ◽  
2018 ◽  
Vol 21 (1) ◽  
pp. 16 ◽  
Author(s):  
Daxiang Deng ◽  
Guang Pi ◽  
Weixun Zhang ◽  
Peng Wang ◽  
Ting Fu
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Numerical Study ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Pumping Power ◽  
Cross Sectional ◽  
Prime Concern ◽  
Microchannel Heat Sinks

This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.

Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sink

2010 ◽  
Author(s):  
Jingru Zhang ◽  
Tiantian Zhang ◽  
Yogesh Jaluria
Keyword(s):  
Liquid Flow ◽  
Heat Sink ◽  
Single Channel ◽  
Numerical Study ◽  
Numerical Models ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Chip Cooling ◽  
Microchannel Heat Sinks

Cooling of electronic chips has become a critical aspect in the development of electronic devices. Overheating may cause the malfunction or damage of electronics and the time needed for heat removal is important. In this paper, an experimental setup and numerical model was developed to test the effects of different parameters and their influence on the transient electronic chip cooling by liquid flow in microchannel heat sinks. The temperature change with time of the system for different heat fluxes at different flow was determined, from which the response time can be obtained. Three different configurations of multi-microchannel heat sinks were tested during the experiment. Numerical models were then developed to simulate the transient cooling for two of the configurations. A good agreement between the experimental data and numerical results showed that single-channel models are capable of simulating the thermal behavior of the entire heat sink by applying appropriate assumptions and boundary conditions.

scholarly journals Temperature Uniformity in Cross-Flow Double-Layered Microchannel Heat Sinks

Fluids ◽  
2020 ◽  
Vol 5 (3) ◽  
pp. 143
Author(s):  
Carlo Nonino ◽  
Stefano Savino
Keyword(s):  
Numerical Study ◽  
Cross Flow ◽  
Bottom Layer ◽  
Heat Sinks ◽  
Temperature Uniformity ◽  
Counter Flow ◽  
Microchannel Heat Sinks ◽  
Unequal Number ◽  
Flow Configurations ◽  
Header Design

An in-house finite element method (FEM) procedure is used to carry out a numerical study on the thermal behavior of cross-flow double-layered microchannel heat sinks with an unequal number of microchannels in the two layers. The thermal performance is compared with those yielded by other more conventional flow configurations. It is shown that if properly designed, i.e., with several microchannels in the top layer smaller than that in the bottom layer, cross-flow double-layered microchannel heat sinks can provide an acceptable thermal resistance and a reasonably good temperature uniformity of the heated base with a header design that is much simpler than that required by the counter-flow arrangement.

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