Numerical simulation and multiobjective optimization of a microchannel heat sink with arc-shaped grooves and ribs

2016 ◽  
Vol 70 (9) ◽  
pp. 1041-1055 ◽  
Author(s):  
G. D. Xia ◽  
Y. T. Jia ◽  
Y. F. Li ◽  
D. D. Ma ◽  
B. Cai
Keyword(s):  
Numerical Simulation ◽  
Multiobjective Optimization ◽  
Heat Sink ◽  
Microchannel Heat Sink

Multiobjective Optimization of a Microchannel Heat Sink Using Evolutionary Algorithm

2008 ◽  
Vol 130 (11) ◽  
Author(s):  
Afzal Husain ◽  
Kwang-Yong Kim
Keyword(s):  
Multiobjective Optimization ◽  
Evolutionary Algorithm ◽  
Performance Optimization ◽  
Heat Sink ◽  
Algorithm Design ◽  
Pareto Optimal ◽  
Microchannel Heat Sink ◽  
Objective Functions ◽  
Design Variables ◽  
Polynomial Response Surface

A multiobjective performance optimization of microchannel heat sink is carried out numerically applying surrogate analysis and evolutionary algorithm. Design variables related to microchannel width, depth, and fin width are selected, and two objective functions, thermal resistance and pumping power, are employed. With the help of finite volume solver, Navier–Stokes analyses are performed at the design sites obtained from full factorial design of sampling methods. Using the numerically evaluated objective function values, polynomial response surface is constructed for each objective functions, and multiobjective optimization is performed to obtain global Pareto optimal solutions. Analysis of optimum solutions is simplified by carrying out trade-off with design variables and objective functions. Objective functions exhibit changing sensitivity to design variables along the Pareto optimal front.

Investigation of Cooling Performance of a Swirl Microchannel Heat Sink by Numerical Simulation

2011 ◽  
Author(s):  
Yanfeng Fan ◽  
Ibrahim Hassan
Keyword(s):  
Numerical Simulation ◽  
Heat Flux ◽  
Heat Sink ◽  
High Heat ◽  
Heat Fluxes ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Irreversible Damage ◽  
Cooling Performance ◽  
Large Heat

High heat fluxes have been created by the semiconductor devices due to the high power generation and shrank size. The large heat flux causes the circuit to exceed its allowable temperature and may experience both working efficiency loss and irreversible damage due to excess in their temperatures. In this paper, a swirl microchannel heat sink is designed to dissipate the large heat flux from the devices. The numerical simulation is carried out to investigate the cooling performance. Uniform heating boundary condition is applied and single phase water is selected as coolant. The present micro heat sink applies multiple swirl microchannels positioned in a circular flat plate to enhance the heat convection by creating the secondary flow at high Reynolds numbers. Copper is selected as the material of heat sink. The channel depth and width are fixed as 0.5 mm and 0.4 mm, respectively. The heat is injected into the system from the bottom of heat sink at the heat fluxes from 10 to 60 W/cm2. Flow is supplied from the top of micro heat sink through a jet hole with a diameter of 2 mm and enters swirl microchannels at the volume flow rates varying from 47 to 188 ml/min. The cooling performances of swirl microchannel heat sinks with different curvatures and channel numbers are evaluated based on the targets of low maximum temperature, temperature gradient and pressure drop.

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