A CEL study of dynamic slamming response and failure mechanism on corrugated core composite-metal sandwich structures

Author(s):  
Changzi Wang ◽  
Shihui Cao ◽  
Shaojia Lu ◽  
Zhiqiang Hu ◽  
Lu Yao ◽  
...  
Author(s):  
Bo Wang ◽  
Yunfeng Shi ◽  
Caihua Zhou ◽  
Tong Li

Polymethacrylimide (PMI) foams have been widely applied in aerospace engineering as the core material of sandwich structures. This paper proposes a modified model to predict the constitutive relation of PMI foams and compares it to existing testing data. The study is then applied to the investigation of the failure mechanism of PMI foam core sandwich beams in bending. Corresponding bending tests were carried out where a complex failure process was observed through a high-speed camera. Numerical model of the foregoing sandwich beam is developed, in which the maximum principal stress criteria is used to predict damage propagation in PMI foam core. Both results from tests and numerical simulation validate the reliability of the theoretical prediction of the failure of PMI foam core sandwich beam using the proposed modified model of PMI foams. This study provides a theoretic tool for the design of sandwich structures with PMI foam core.


2009 ◽  
Vol 29 (11) ◽  
pp. 1626-1640 ◽  
Author(s):  
K.V. Arun ◽  
S. Manjunath Yadav ◽  
Chandradharappa ◽  
S. Basavarajappa ◽  
M. Krishna

2021 ◽  
Vol 116 ◽  
pp. 102862
Author(s):  
Wentao He ◽  
Xiaofei Cui ◽  
Changzi Wang ◽  
Junlin Deng ◽  
Qi Hu ◽  
...  

2018 ◽  
Vol 160 ◽  
pp. 179-193 ◽  
Author(s):  
H. Yazdani Sarvestani ◽  
A.H. Akbarzadeh ◽  
A. Mirbolghasemi ◽  
K. Hermenean

Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2008 ◽  
Vol 11 (-1) ◽  
pp. 188-201 ◽  
Author(s):  
Piotr Bogacz ◽  
Jarosława Kaczmarek ◽  
Danuta Leśniewska

2010 ◽  
Vol 52 (11-12) ◽  
pp. 765-770 ◽  
Author(s):  
Stefan Dietrich ◽  
Jan Kuppinger ◽  
Peter Elsner ◽  
Kay Weidenmann

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