Wafer-scale patterning of sub-40 nm diameter and high aspect ratio (>50:1) silicon pillar arrays by nanoimprint and etching

The present paper reported a novel approach for the fabrication of a high-aspect ratio (K, Na)NbO3 (KNN) piezoelectric micropillar array via epoxy gelcasting, which involves the in situ consolidation of aqueous KNN suspensions with added hydantoin epoxy resin on a polydimethylsiloxane (PDMS) soft micromold. KNN suspensions with solid loadings of up to 45.0 vol.% have rheological behavior, which was suitable for the gelcasting process. The uniform green KNN bodies derived from the optimized suspension of 42.0 vol.% solid loading and 15.0 wt.% resin had exceptionally high mechanical strength (9.14 MPa), which was responsible for the integrity of the piezoceramic micropattern structure. The square-shaped KNN piezoelectric pillar array with lateral dimensions of up to 5 μm and an aspect ratio of up to five was successfully fabricated.

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High-throughput design and fabrication of an integrated microsystem with high aspect-ratio sub-micron pillar arrays for free-solution micro capillary electrophoresis

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/16/4/005 ◽

2006 ◽

Vol 16 (4) ◽

pp. 699-707 ◽

Cited By ~ 51

Author(s):

Yick Chuen Chan ◽

Yi-Kuen Lee ◽

Yitshak Zohar

Keyword(s):

Capillary Electrophoresis ◽

Aspect Ratio ◽

High Throughput ◽

High Aspect Ratio ◽

Free Solution ◽

Pillar Arrays

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Fabrication of bifacial wafer-scale silicon nanowire arrays with ultra-high aspect ratio through controllable metal-assisted chemical etching

Materials Letters ◽

10.1016/j.matlet.2014.10.084 ◽

2015 ◽

Vol 139 ◽

pp. 437-442 ◽

Cited By ~ 10

Author(s):

Yumin Liu ◽

Weiwei Sun ◽

Yun Jiang ◽

Xing-Zhong Zhao

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Chemical Etching ◽

Silicon Nanowire ◽

Nanowire Arrays ◽

Wafer Scale ◽

Silicon Nanowire Arrays ◽

Metal Assisted Chemical Etching

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Fabrication of Micromachined Mold Masters for 3-D, High-Aspect-Ratio Cell Culturing Scaffolds

Microelectromechanical Systems ◽

10.1115/imece2005-81991 ◽

2005 ◽

Author(s):

Yanzhu Zhao ◽

Xiaosong Wu ◽

Yong-Kyu Yoon ◽

Jung-Hwan Park ◽

Stephen J. Kennedy ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Reactive Ion Etching ◽

Bone Cell ◽

Ion Etching ◽

Deep Reactive Ion Etching ◽

Wafer Scale ◽

Advantages And Disadvantages ◽

Cell Culturing ◽

Mold Master

In this paper, three approaches to micromachined mold master structures for molding of a wafer-scale bone culturing platform are compared and contrasted. The processes investigated are a silicon deep-reactive ion etching (DRIE) process, an SU-8/polydimethylsiloxane(PDMS) process, and a multi-step SU-8 process. Upon comparison of the advantages and disadvantages of each approach, a wafer-scale implementation of bone cell culturing substrates is successfully demonstrated using the two-step SU-8 process, and successful duplication of hydrogels based on these molds is demonstrated.

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