scholarly journals Development of mathematical model of disperse particle motion in the plasma flow in the field of boundary layer during plasma spraying

2018 ◽  
Vol 1096 ◽  
pp. 012190 ◽  
Author(s):  
V I Bogdanovich ◽  
M G Giorbelidze
2019 ◽  
Vol 97 ◽  
pp. 05023 ◽  
Author(s):  
Daler Sharipov ◽  
Sharofiddin Aynakulov ◽  
Otabek Khafizov

The paper deals with the development of mathematical model and numerical algorithms for solving the problem of transfer and diffusion of aerosol emissions in the atmospheric boundary layer. The model takes into account several significant parameters such as terrain relief, characteristics of underlying surface and weather-climatic factors. A series of numerical experiments were conducted based on the given model. The obtained results presented here show how these factors affect aerosol emissions spread in the atmosphere.


JETP Letters ◽  
2004 ◽  
Vol 79 (8) ◽  
pp. 368-371 ◽  
Author(s):  
S. P. Savin ◽  
L. M. Zelenyi ◽  
E. Amata ◽  
J. Buechner ◽  
J. Blecki ◽  
...  

2016 ◽  
Vol 9 (7) ◽  
pp. 2369-2377 ◽  
Author(s):  
Muhammad Khairul Anuar Mohamed ◽  
Nor Aida Zuraimi Noar ◽  
Mohd Zuki Salleh ◽  
Anuar Ishak ◽  
◽  
...  

Tribology ◽  
2005 ◽  
Author(s):  
Elon J. Terrell ◽  
Venkata K. Jasti ◽  
C. Fred Higgs

Chemical mechanical polishing (CMP) has emerged as a commonly used method for achieving global surface planarization of micro-/nano-scale systems during fabrication. During CMP, the wafer to be polished is pressed against a rotating polymeric pad that is flooded with slurry. The motion of the wafer surface against the asperities of the pad and the abrasive nanoscale particles in the slurry causes the surface of the wafer to be polished to an atomically smooth level. Past studies have shown that the wear distribution is a function of the distribution of slurry particles in the wafer/pad interface, and thus it is desirable to model the migration of particles in order to predict the wear of the wafer surface. The current study involves the creation and simulation of a mathematical model which predicts the paths of slurry particles in a Lagrangian reference frame. The model predicts the effects of the various forces on each particle to determine its motion. The model also accounts for interparticle collisions and wafer/particle and pad/particle collisions. It is expected that the particle motion that is predicted from this model will allow for a more accurate correlation of the wafer surface wear distribution.


1980 ◽  
Vol 99 (2) ◽  
pp. 293-319 ◽  
Author(s):  
J. H. M. Disselhorst ◽  
L. Van Wijngaarden

The flow near the mouth of an open tube is examined, experimentally and theoretically, under conditions in which resonant acoustic waves are excited in the tube at the other end. If the edge of the tube is round, separation does not occur at high Strouhal numbers, which enables us to verify theoretical predictions for dissipation in the boundary layer and for acoustic radiation. Observation with the aid of schlieren pictures shows that in the case of a sharp edge vortices are formed during inflow. The vortices are shed from the pipe during outflow. Based on these observations a mathematical model is developed for the generation and shedding of vorticity. The main result of the analysis is a boundary condition for the pressure in the wave, to be applied near the mouth. The pressure amplitudes in the acoustic wave measured under resonance are compared with theoretical predictions made with the aid of the boundary condition obtained in the paper.


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