scholarly journals Preparation of Inorganic Filler Modified Epoxy Resin Adhesive and Study on Its Compatibility with UDMH

2021 ◽  
Vol 1802 (2) ◽  
pp. 022046
Author(s):  
Pan Hu ◽  
Zhiyong Huang ◽  
Guofeng Jin ◽  
Jianshuo Zhao ◽  
Yi Guo
2011 ◽  
Vol 415-417 ◽  
pp. 35-38 ◽  
Author(s):  
Guang Qing Gai ◽  
Xiang Ting Dong ◽  
Xue Song Chen ◽  
Cheng Yan Zheng

The nano-particle modified epoxy resin adhesive was prepared by adding different types of nanoparticles to the epoxy resin adhesives.The influence of the kinds and amount of nanoparticles on the mechanical properties of epoxy resin adhesive was investigated.The investigation results indicated that the addition of three kinds of nanoparticles including nano-silica,nano-titanium dioxide,nano zinc oxide to epoxy resin adhesive has a significant influence on the mechanical properties of nano-composites.And tensile strength and breaking elongation of nano-composites reached the maximum when the amount of nanoparticle reached 4wt%.In addition,the toughening mechanisms of nano-particles modified epoxy resin adhesives was analysed.


2021 ◽  
Vol 5 (1) ◽  
pp. 7
Author(s):  
Ety Jumiati ◽  
Endang Sagita Ritonga ◽  
Abdul Halim Daulay

<p><strong><em>Abstract</em></strong><strong></strong></p><p><strong><em>Abstract. This study aims to determine the effect of optimal physical properties and microstructure on particleboard samples. The percentage variations of cocoa pod peel powder mixture, styrofoam with epoxy resin adhesive were sample A (69:0:30), sample B (68:2:30), sample C (67:3:30), and sample D (66:4:30). 6:30). The materials were compressed were a hot press and a conditioning time of 14 days. sThe most optimum particleboard sample was found in sample B with values of density, moisture content, and thickness expansion, respectively 0,80 g/cm</em></strong><strong><em><sup>2</sup></em></strong><strong><em>, 7,74%, and 9,32%, and met the standards of SNI 03-2105- 2006. The surface shape of the particle board morphology in sample B shows the composition of the material with the adhesive binding optimally so that there are very few empty spaces or cavities.</em></strong><strong></strong></p><h1 align="center"><em> </em></h1><p><strong><em>Keywords:</em></strong><em> cocoa pod husk powder, styrofoam, particle board, epoxy resin.</em></p>


2014 ◽  
Vol 633-634 ◽  
pp. 387-390
Author(s):  
Yang Huang ◽  
Ling Tian

Based on a certain type of aircraft structure repair adhesive was studied, the curing temperature of aircraft structure repair commonly used adhesive process of high, long curing time, curing thermal stress problem, with epoxy resin as basic material, by adding elastic toughening Ding Jin g rubber, curing agent and silane coupling agent modification on Toughening of epoxy resin. The mechanical properties of adhesive were analyzed through the cyclic loading test and tensile shear test, and the best ratio of modified epoxy resin adhesive. The adhesive prepared at 80 °C for 90 min after curing shear strength can reach 35MPa, which can meet the aircraft structure damage daily emergency repair requirements.


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