scholarly journals Thermal Emissivity Measurement with Two-temperature Method

2021 ◽  
Vol 2002 (1) ◽  
pp. 012056
Author(s):  
Yunbin Ying ◽  
Qiang Li ◽  
Sandeep Kaur ◽  
Pintu Ghosh
1991 ◽  
Vol 224 ◽  
Author(s):  
C. Schietinger ◽  
B. Adams ◽  
C. Yarling

AbstractA novel wafer temperature and emissivity measurement technique for rapid thermal processing (RTP) is presented. The ‘Ripple Technique’ takes advantage of heating lamp AC ripple as the signature of the reflected component of the radiation from the wafer surface. This application of Optical Fiber Thermometry (OFT) allows high speed measurement of wafer surface temperatures and emissivities. This ‘Ripple Technique’ is discussed in theoretical and practical terms with wafer data presented. Results of both temperature and emissivity measurements are presented for RTP conditions with bare silicon wafers and filmed wafers.


APL Materials ◽  
2014 ◽  
Vol 2 (12) ◽  
pp. 126101 ◽  
Author(s):  
J. T. Griffiths ◽  
T. Zhu ◽  
F. Oehler ◽  
R. M. Emery ◽  
W. Y. Fu ◽  
...  

2017 ◽  
Vol 254 (8) ◽  
pp. 1600724 ◽  
Author(s):  
Tong Wang ◽  
Tim J. Puchtler ◽  
Tongtong Zhu ◽  
John C. Jarman ◽  
Rachel A. Oliver ◽  
...  

1973 ◽  
Vol 16 (5) ◽  
pp. 719-721
Author(s):  
V. P. Severdenko ◽  
V. A. Labunov ◽  
E. E. Tkharev ◽  
A. P. Kazantsev

1980 ◽  
Vol 36 (3) ◽  
pp. 203-205 ◽  
Author(s):  
Osamu Hasegawa ◽  
Ryosuke Namazu

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