Effect of the distance between the micro/nanostructures on pool boiling heat transfer with water on a copper heater
Abstract Copper heaters were made. On the surface of these heaters the arrays of micrococoons were synthesized from silicon oxide (SiOx) nanowires with different concentrations of micro/nanostructures and hence different average distances between them. Boiling curves were obtained for these samples and it was found that heat transfer enhancement during boiling occurs on them in comparison with a smooth copper surface. It was shown that the effect increases with decreasing concentration of micro/nanostructures and reaches a maximum for microrelief with an approximate concentration of microstructures equal to unity per square micron. It was found that surfaces with micrococoons are sufficiently stable and suitable for enhancing heat transfer during boiling.
