Persistence

2011 ◽  
Author(s):  
Yuri Balashov
Keyword(s):  
Three Dimensional ◽  
Solid Base ◽  
The Future ◽  
Temporal Parts ◽  
Dimensional Object ◽  
Four Dimensionalism

Regardless of whether the future or past are real, there is also the question of what objects are. What is it for an object to persist in time? At one time, one is short and at another time tall. Is something a four-dimensional object with different temporal parts? Or is there a wholly present three-dimensional entity that changes properties? This chapter gives a survey of this problem, updating three positions on it to the relativistic context, and providing the reader with a solid base from which to evaluate the positions. It notes that people recognize the problem of persistence as being primarily about parthood and location, and also sketches views known as three-dimensionalism (3Dism) or endurantism, and four-dimensionalism (4Dism) or perdurantism.

Reconstruction of Objects from their Projections Using Orthogonal Functions

1973 ◽  
Vol 31 ◽  
pp. 268-269
Author(s):  
Elrnar Zeitler
Keyword(s):  
Unit Area ◽  
Three Dimensional ◽  
One Dimension ◽  
Spatial Density ◽  
Dimensional Representation ◽  
Orthogonal Functions ◽  
Object A ◽  
Plane Normal ◽  
Dimensional Object ◽  
Spatial Density Distribution

Considering any finite three-dimensional object, a “projection” is here defined as a two-dimensional representation of the object's mass per unit area on a plane normal to a given projection axis, here taken as they-axis. Since the object can be seen as being built from parallel, thin slices, the relation between object structure and its projection can be reduced by one dimension. It is assumed that an electron microscope equipped with a tilting stage records the projectionWhere the object has a spatial density distribution p(r,ϕ) within a limiting radius taken to be unity, and the stage is tilted by an angle 9 with respect to the x-axis of the recording plane.

Current and Future Three-Dimensional LSI Integration Technology by “chip on chip”, “chip on wafer” and “wafer on wafer”

2006 ◽  
Vol 970 ◽  
Author(s):  
Manabu Bonkohara ◽  
Makoto Motoyoshi ◽  
Kazutoshi Kamibayashi ◽  
Mitsumasa Koyanagi
Keyword(s):  
Three Dimensional ◽  
Process Time ◽  
Future Technology ◽  
Sensor Device ◽  
Research Level ◽  
Key Technologies ◽  
The Future ◽  
Chip Size ◽  
On Chip ◽  
Chip Chip

ABSTRACTRecently the development of three dimensional LSI (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a view to mass production. This paper describes the current and the future 3D-LSI technologies which we have considered and imagined. The current technology is taken our Chip Size Package (CSP) for sensor device, for instance. In the future technology, there are the five key technologies are described. And considering con and pro of the current 3D LSI stacked approach, such as CoC (Chip on Chip), CoW (Chip on Wafer) and WoW (Wafer on Wafer), We confirmed that CoW combined with Super-Smart-Stack (SSS™) technology will shorten the process time per chip at the same level as WoW approach and is effective to minimize process cost.

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