scholarly journals On-chip light diffraction imaging of nano structures in the guanine platelet

2021 ◽  
Author(s):  
Masakazu Iwasaka
Keyword(s):  
Water Layer ◽  
Image Sensor ◽  
Light Diffraction ◽  
Cover Glass ◽  
Bar Code ◽  
Projected Image ◽  
Nano Structures ◽  
Diffraction Imaging ◽  
Scale Spaces ◽  
On Chip

Light projection over short distances can minimize the size of photonic devices, e.g., head-mounted displays and lens-free microscopes. Small lenses or light condensers without typical lenses are essential for light control in micron-scale spaces. In this work, micro-platelets floating in water are used for light projection near the image sensor. These platelets, which are made from guanine, have nanohole gratings and demonstrate light diffraction toward specific directions. By setting a thin water layer on the image sensor's cover glass, each platelet in water forms column- or bar-code-shaped images on the screen. The projected image shapes and colors are inferred to contain information about nano-structures present in the guanine platelet. The proposed down-sized imaging technique can realize extremely compact and portable imagers for nanoscale object detection.

On-chip light scattering imaging of the guanine platelet

2021 ◽  
Author(s):  
Masakazu Iwasaka
Keyword(s):  
Light Scattering ◽  
Control Mechanism ◽  
Water Layer ◽  
Image Sensor ◽  
The Body ◽  
Cover Glass ◽  
Bar Code ◽  
Electromagnetic Simulations ◽  
Narrow Space ◽  
On Chip

Abstract A guanine platelet is a very thin optical component that plays a role in light reflection control in the narrow space within the body of a fish. However, the details of this light control mechanism have not been revealed to date. In this work, guanine micro-platelets floating in water are visualized via light projection near an image sensor. These guanine platelets demonstrate light scattering toward specific directions. By setting a thin water layer on top of the image sensor’s cover glass, each platelet in the water layer forms column- or bar-code-shaped images on the screen. The existence of nanohole gratings in these platelets was confirmed by high-resolution optical microscopy. Numerical electromagnetic simulations indicated that the nanohole gratings contributed to the formation of unique light projection spots.

scholarly journals Microfluidic-based imaging of complete C. elegans larval development

2021 ◽  
Author(s):  
Simon Berger ◽  
Silvan Spiri ◽  
Andrew deMello ◽  
Alex Hajnal
Keyword(s):  
Imaging Method ◽  
Cover Glass ◽  
Vulval Development ◽  
C Elegans ◽  
Larval Stages ◽  
Seam Cell ◽  
Time Observation ◽  
On Chip ◽  
First Time

Several microfluidic-based methods for long-term C. elegans imaging have been introduced in recent years, allowing real-time observation of previously inaccessible processes. The ex-isting methods either permit imaging across multiple larval stages without maintaining a stable worm orientation, or allow for very good immobilization but are only suitable for shorter experiments. Here, we present a novel microfluidic imaging method, which allows parallel live-imaging across multiple larval stages, while delivering excellent immobilization and maintaining worm orientation and identity over time. This is achieved by employing an array of microfluidic trap channels carefully tuned to maintain worms in a stable orienta-tion, while allowing growth and molting to occur. Immobilization is supported by an active hydraulic valve, which presses worms onto the cover glass during image acquisition, with the animals remaining free for most of an experiment. Excellent quality images can be ac-quired of multiple worms in parallel, with little impact of the imaging method on worm via-bility or developmental timing. The capabilities of this methodology are demonstrated by observing the hypodermal seam cell divisions and, for the first time, the entire process of vulval development from induction to the end of morphogenesis. Moreover, we demonstrate RNAi on-chip, which allows for perturbation of dynamic developmental processes, such as basement membrane breaching during anchor cell invasion.

Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000015-000022
Author(s):  
Paul Enquist
Keyword(s):  
Low Temperature ◽  
Sensor Arrays ◽  
Cost Savings ◽  
Image Sensor ◽  
Network On Chip ◽  
Wafer Scale ◽  
Direct Bond ◽  
3D Network ◽  
On Chip ◽  
3D Volume

3D microelectronics integration and wafer scale packaging promise improvements in functional density and cost compared to conventional 2D microelectronics and packaging technologies. The realization of these improvements will require further adoption of 3D volume manufacturing process technologies. These process technologies will likely include through silicon via (TSV) and die or wafer bonding with and without 3D interconnect. Low temperature direct bond technologies have a number of inherent performance and cost advantages compared to other bonding technologies. This paper describes low temperature direct oxide bond technologies with and without a scalable 3D interconnect developed by Ziptronix and cost savings, performance and applications that will be enabled by adoption of these technologies. Enabled cost savings and performance include system or network-on-chip, system in package, and TSVs. Enabled applications include backside illuminated image sensors, micron-scale pitch vertically integrated image sensor arrays, 3D system-on-chip and 3D network-on-chip.

scholarly journals A 120-ke− Full-Well Capacity 160-µV/e− Conversion Gain 2.8-µm Backside-Illuminated Pixel with a Lateral Overflow Integration Capacitor

Sensors ◽  
2019 ◽  
Vol 19 (24) ◽  
pp. 5572
Author(s):  
Isao Takayanagi ◽  
Ken Miyauchi ◽  
Shunsuke Okura ◽  
Kazuya Mori ◽  
Junichi Nakamura ◽  
...  
Keyword(s):  
Dynamic Range ◽  
Incident Light ◽  
Complementary Metal Oxide Semiconductor ◽  
Image Sensor ◽  
Oxide Semiconductor ◽  
Conversion Gain ◽  
Cover Glass ◽  
Low Light ◽  
Light Signals ◽  
Backside Illuminated

In this paper, a prototype complementary metal-oxide-semiconductor (CMOS) image sensor with a 2.8-μm backside-illuminated (BSI) pixel with a lateral overflow integration capacitor (LOFIC) architecture is presented. The pixel was capable of a high conversion gain readout with 160 μV/e− for low light signals while a large full-well capacity of 120 ke− was obtained for high light signals. The combination of LOFIC and the BSI technology allowed for high optical performance without degradation caused by extra devices for the LOFIC structure. The sensor realized a 70% peak quantum efficiency with a normal (no anti-reflection coating) cover glass and a 91% angular response at ±20° incident light. This 2.8-μm pixel is potentially capable of higher than 100 dB dynamic range imaging in a pure single exposure operation.

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