A signal path grouping algorithm for fast detection of short circuits on printed circuit boards

1994 ◽  
Vol 43 (1) ◽  
pp. 80-85 ◽  
Author(s):  
Yiu-Wing Leung
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Fast Detection ◽  
Printed Circuit ◽  
Signal Path ◽  
Short Circuits ◽  
Grouping Algorithm

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules

Circuit World ◽  
2015 ◽  
Vol 41 (3) ◽  
pp. 121-124
Author(s):  
Wojciech Stęplewski ◽  
Mateusz Mroczkowski ◽  
Radoslav Darakchiev ◽  
Konrad Futera ◽  
Grażyna Kozioł
Keyword(s):  
Printed Circuit Boards ◽  
New Technologies ◽  
Circuit Board ◽  
Circuit Boards ◽  
Content Type ◽  
Signal Distribution ◽  
Printed Circuit ◽  
Rapid Design ◽  
Small Pitch ◽  
Signal Path

Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology. Originality/value – This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.

Electromigration and Flux Residues

2021 ◽  
Vol 105 (1) ◽  
pp. 401-409
Author(s):  
Jiri Stary ◽  
Petr Vanysek ◽  
Vitezslav Novak
Keyword(s):  
Printed Circuit Boards ◽  
Electrochemical Impedance ◽  
Basic Knowledge ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Soldering Process ◽  
Surface Finishes ◽  
Surface Insulation Resistance ◽  
Short Circuits ◽  
Through Hole

Electromigration and its subcategory electrochemical migration is a serious problem in electronic industry working with printed circuit boards (PCB). Smaller equipment with high density of interconnection (HDI) is assembled with surface mounted devices (SMD) and through hole components (THC) Assembly techniques are realised mainly by soldering process with no clean fluxes. Result is not only a reliable solder joint, but also flux residues. The first part of the article after short theory is focused on gatering basic knowledge about fluxes and surface finishes by using cyclic voltammetry (CV) and electrochemical impedance spectrometry (EIS). The second part of the experiments is oriented on practical test with different fluxes for wave and reflow soldering. These tests are associated with the reduction of surface insulation resistance, corrosion, dendrite/fiber growth and the formation of subsequent short circuits. The acceleration of these electrochemical reactions is helped by higher working temperatures, higher humidity, and magnitude \ and frequency of electrical voltage between the conductors.

Space Dependence of Divided Ground Patterns on FM-Band Cross-Talk Characteristics between Two Parallel Signal Traces on Printed Circuit Boards for Vehicles

2012 ◽  
Vol 132 (12) ◽  
pp. 1897-1903 ◽  
Author(s):  
Michihira Iida ◽  
Tsuyoshi Maeno ◽  
Jianqing Wang ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Space Dependence

Effect of Water Absorption Temperature on Space Charge Profiles in Paper/phenol-resin Composites for Printed Circuit Boards

2008 ◽  
Vol 128 (9) ◽  
pp. 585-590 ◽  
Author(s):  
Yasutsune Echigo ◽  
Masashi Natsui ◽  
Takashi Maeno ◽  
Yoshimichi Ohki
Keyword(s):  
Space Charge ◽  
Water Absorption ◽  
Printed Circuit Boards ◽  
Resin Composites ◽  
Circuit Boards ◽  
Phenol Resin ◽  
Printed Circuit ◽  
Effect Of Water
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