MIM capacitance efficiency study for high speed I/O power integrity network design: MIM and MIMless high speed I/O performance characterization

Author(s):  
Fern Nee Tan ◽  
Ming Dak Chai ◽  
Mohamad Shahrir bin Tamrin
Author(s):  
Ki-Sang Song ◽  
Arun K. Somani

From the 1994 CAIS Conference: The Information Industry in Transition McGill University, Montreal, Quebec. May 25 - 27, 1994.Broadband integrated services digital network (B-ISDN) based on the asynchronous transmission mode (ATM) is becoming reality to provide high speed, multi bit rate multimedia communications. Multimedia communication network has to support voice, video and data traffics that have different traffic characteristics, delay sensitive or loss sensitive features have to be accounted for designing high speed multimedia information networks. In this paper, we formulate the network design problem by considering the multimedia communication requirements. A high speed multimedia information network design alogrithm is developed using a stochastic optimization method to find good solutions which meet the Quality of Service (QoS) requirement of each traffic class with minimum cost.


Author(s):  
Xiaoyu Wang ◽  
Malathi Veeraraghavan ◽  
Maite Brandt-Pearce ◽  
Takahiro Miyazaki ◽  
Naoaki Yamanaka ◽  
...  

Author(s):  
Marco Ruffini ◽  
Nick Doran ◽  
Mohand Achouche ◽  
Nick Parsons ◽  
Thomas Pfeiffer ◽  
...  

Author(s):  
Jingook Kim ◽  
James Drewniak ◽  
Jun Fan

In this paper, a simple circuit model for IC multiple power and ground via arrays in a multilayer PCB is built based on the resonant cavity model. Using the circuit model, the parasitic inductance for the IC power and ground connection is quantitatively investigated according to via number and via patterns. The stack-up configuration of the power/ground plane pair is not critical for PDN performance in multilayer PCBs, as long as there are sufficient IC power/ground vias in an alternating pattern. The outcome of this work can be used to guide the pin-map design for high-speed packages.


2017 ◽  
Vol 23 (6) ◽  
pp. 5019-5023
Author(s):  
Yee Chang Fei ◽  
Asral Bahari Jambek ◽  
Azremi Abdullah Al-Hadi

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