Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing

Author(s):  
Bijan K. Tehrani ◽  
Benjamin S. Cook ◽  
Manos M. Tentzeris
Keyword(s):  
2012 ◽  
Vol 1401 ◽  
Author(s):  
A. Yakoub ◽  
M. Saadaoui ◽  
R. Cauchois ◽  
J-M. Li ◽  
P. Benaben

ABSTRACTThis paper describes an in-line process for the realization of 3D electronic components on A4 format substrate by piezo inkjet printing. This process is developed within a semi-industrial prototype system named “JETPAC”. JETPAC includes an oxygen plasma torch for surface preparation and post-process modules as a variable frequency microwave oven and an UV lamp for metal selective sintering and dielectric ink curing, respectively. JETPAC is used to achieve passive components by chaining conductor and dielectric layers on kapton® substrate: silver nanoparticles based ink is used to print conductors. For multilayer component elaboration, the metal ink is deposited both on kapton® and on printed dielectric materials. Due to a low surface energy (S.E) of the printed dielectric, the realization of efficient silver tracks is compromised. A special process combines O2 plasma treatment and UV exposure before printing, allowing the reaching of S.E. value on dielectric near the optimum one (55mN/m). This pre-process allows printing of well-defined conductive structures on top of the dielectric. In-line sintering of printed structures is then performed using variable frequency microwave source. The process allows the elaboration of multilayer structures including stacked resistors and capacitors. These results make the developed process very promising for the realization by inkjet printing of passive devices for smart tag applications.


Author(s):  
Alfonso Arturo Castrejon-Pita ◽  
Eleanor S Betton ◽  
Nick Campbell ◽  
Nick Jackson ◽  
Jonathan Morgan ◽  
...  
Keyword(s):  

2019 ◽  
Vol 2019 (1) ◽  
pp. 56-59
Author(s):  
Erik Beckert ◽  
Falk Kemper ◽  
Sabrina-Jasmin Wolleb ◽  
Maximilian Reif ◽  
Soenke Steenhusen
Keyword(s):  

2018 ◽  
Vol 2018 (1) ◽  
pp. 107-112 ◽  
Author(s):  
Min Zhao ◽  
Susana Diaz Amaya ◽  
Seon-ah Jin ◽  
Li-Kai Lin ◽  
Amanda J. Deering ◽  
...  

2017 ◽  
Vol 61 (5) ◽  
pp. 505051-505057 ◽  
Author(s):  
Zundong Liu ◽  
Kuanjun Fang ◽  
Hongguo Gao ◽  
Xiuming Liu ◽  
Jianfei Zhang ◽  
...  

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.


2019 ◽  
Author(s):  
Mykhailo Sytnyk ◽  
Ole Lytken ◽  
Tim Freund ◽  
Wolfgang Heiss ◽  
Christina Harreiss ◽  
...  

2020 ◽  
Vol 36 ◽  
pp. 101544
Author(s):  
Devin J. Roach ◽  
Christopher Roberts ◽  
Janet Wong ◽  
Xiao Kuang ◽  
Joshua Kovitz ◽  
...  

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