Ultra low loss and high linearity RF switch using 130nm SOI CMOS process

This paper presents a highly-integrated transceiver with a differential structure for C-band (5–6[Formula: see text]GHz) radar application using a switchless and baluns-embedded configuration. To reduce the noise figure (NF) in receiver (Rx) mode and enhance the output power in transmitter (Tx) mode, the balun at RF port is embedded into the low-noise amplifier (LNA) and the power amplifier (PA), respectively. Besides, the RF switch is removed by designing the matching networks that both LNA and PA can share. The same topology is also adopted at the IF port. To achieve a high image rejection ratio (IRR), a Hartley architecture using polyphase filters (PPFs) is adopted. The proposed transceiver has been implemented in 1P6M 0.18-[Formula: see text]m CMOS process. The receiver achieves 6.9-dB NF, [Formula: see text]7.5-dBm IIP3 and 26.3-dB gain with three-step digital gain controllability. Also the measured IRR is better than 41[Formula: see text]dBc. The transmitter achieves 9.6-dBm output power and 19.2-dB gain. The chip consumes 106[Formula: see text]mA in the Rx mode and 141[Formula: see text]mA in the Tx mode from the 3.3-V power supply.

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A Low-Loss and High-Isolation Transformer-Based mm-Wave SPDT with Integrated Fan-out Wafer Level Packaging

Journal of Circuits System and Computers ◽

10.1142/s0218126620501157 ◽

2019 ◽

Vol 29 (07) ◽

pp. 2050115

Author(s):

Xing Quan ◽

Jiang Luo ◽

Guodong Su ◽

Kai Jing ◽

Jinsong Zhan

Keyword(s):

Design Method ◽

Control Device ◽

Secondary Coil ◽

Cmos Process ◽

Wafer Level ◽

Low Loss ◽

High Isolation ◽

Wafer Level Packaging ◽

Isolation Transformer ◽

Better Than

This paper proposes a low-loss and high-isolation transformer (TF)-based mm-wave single-pole double-throw (SPDT) switch. The center-tapped technique is employed at the secondary coil of TF to improve isolation performance. The TF is implemented with the metals in redistribution layers (RDLs) in integrated fan-out (InFO) wafer level packaging technology to obtain low insertion loss (IL) and small chip size as the TF usually dominates the area of SPDT. The control device of the SPDT is realized in 40[Formula: see text]nm bulk CMOS process. The simulated result shows the proposed SPDT achieves a minimum IL of 1.34[Formula: see text]dB and the IL is less than 2.2[Formula: see text]dB at 24–31[Formula: see text]GHz. The isolations are better than 27[Formula: see text]dB between two double-throw ports and better than 20[Formula: see text]dB between single-pole and double-throw ports, respectively. The proposed SPDT has a compact silicon size of 220[Formula: see text][Formula: see text] (with PADs) and its return losses are better than [Formula: see text]9[Formula: see text]dB at 24–31[Formula: see text]GHz and. This work explores a new chip-package co-design method for the SPDT and may have some guidance for the co-design of SPDT and antenna in package (AiP).

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