Subjective video quality test: Methodology, database and experience

Author(s):  
Rafael Sotelo ◽  
Jose Joskowicz ◽  
Juan Pablo Garella ◽  
Diego Duran ◽  
Marcos Juayek
Author(s):  
T.K. Tan ◽  
K.D. McCann ◽  
M. Mrak ◽  
R. Weerakkody ◽  
V. Baroncini ◽  
...  

2018 ◽  
Vol 6 (3) ◽  
pp. 213-221
Author(s):  
Soo-Hwan Lee ◽  
You-Ho Kim ◽  
Sang-ahm Kim ◽  
Hyun-Ju Hwang ◽  
Yong-Woon Choi

2012 ◽  
Vol 58 (2) ◽  
pp. 147-152
Author(s):  
Michal Mardiak ◽  
Jaroslav Polec

Objective Video Quality Method Based on Mutual Information and Human Visual SystemIn this paper we present the objective video quality metric based on mutual information and Human Visual System. The calculation of proposed metric consists of two stages. In the first stage of quality evaluation whole original and test sequence are pre-processed by the Human Visual System. In the second stage we calculate mutual information which has been utilized as the quality evaluation criteria. The mutual information was calculated between the frame from original sequence and the corresponding frame from test sequence. For this testing purpose we choose Foreman video at CIF resolution. To prove reliability of our metric were compared it with some commonly used objective methods for measuring the video quality. The results show that presented objective video quality metric based on mutual information and Human Visual System provides relevant results in comparison with results of other objective methods so it is suitable candidate for measuring the video quality.


2018 ◽  
Vol 23 (2) ◽  
pp. 97-114
Author(s):  
Sanghak Lee ◽  
Paul M Pedersen
Keyword(s):  

Author(s):  
Jenny Fan ◽  
Dave Mark

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.


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