scholarly journals Fast temperature sensing for GaN power devices using E-field probes

2020 ◽  
Author(s):  
Mohammad H. Hedayati ◽  
Harry C. P. Dymond ◽  
Dawei Liu ◽  
Bernard H. Stark
Keyword(s):  
Temperature Sensing ◽  
Power Devices

scholarly journals Infinity Sensor: Temperature Sensing in GaN Power Devices using Peak di/dt

2018 ◽  
Author(s):  
Jianjing Wang ◽  
Mohammad H. Hedayati ◽  
Dawei Liu ◽  
Salah-Eddine Adami ◽  
Harry C. P. Dymond ◽  
...  
Keyword(s):  
Temperature Sensing ◽  
Power Devices ◽  
Sensor Temperature

A New Scanning Thermal Microprobe

1997 ◽  
Vol 503 ◽  
Author(s):  
Yongxia Zhang ◽  
Yanwei Zhang ◽  
Juliana Blaser ◽  
T. S. Sriiram ◽  
R. B. Marcus
Keyword(s):  
Thin Film ◽  
High Resolution ◽  
Thermal Response ◽  
Temperature Sensing ◽  
Thermal Sensor ◽  
Atomic Force ◽  
Thin Film Thermocouple ◽  
Processing Steps ◽  
Thermocouple Junction

ABSTRACTA thermal microprobe has been designed and built for high resolution temperature sensing. The thermal sensor is a thin-film thermocouple junction at the tip of an Atomic Force Microprobe (AFM) silicon probe needle. Only wafer-stage processing steps are used for the fabrication. The thermal response over the range 25–s 4.5–rovolts per degree C and is linear.

Defect engineering in SiC technology for high-voltage power devices

2020 ◽  
Vol 13 (12) ◽  
pp. 120101
Author(s):  
Tsunenobu Kimoto ◽  
Heiji Watanabe
Keyword(s):  
High Voltage ◽  
Defect Engineering ◽  
Power Devices
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