Steady-state and transient electro-thermal simulation of power devices and MMICs based on 3D physical thermal models

2007 ◽  
Author(s):  
J. Ding ◽  
D. Linton
Keyword(s):  
Steady State ◽  
Thermal Simulation ◽  
Power Devices ◽  
Thermal Models

scholarly journals Comparison of Thermal Stress during Short-Circuit in Different Types of 1.2 kV SiC Transistors Based on Experiments and Simulations

2017 ◽  
Vol 897 ◽  
pp. 595-598
Author(s):  
Diane Perle Sadik ◽  
Jang Kwon Lim ◽  
Juan Colmenares ◽  
Mietek Bakowski ◽  
Hans Peter Nee
Keyword(s):  
Thermal Stress ◽  
Short Circuit ◽  
Thermal Simulation ◽  
Temperature Evolution ◽  
Power Devices ◽  
Different Types ◽  
Transient Thermal

The temperature evolution during a short-circuit in the die of three different Silicon Carbide1200-V power devices is presented. A transient thermal simulation was performed based on the reconstructedstructure of commercially available devices. The location of the hottest point in the device iscompared. Finally, the analysis supports the necessity to turn off short-circuit events rapidly in orderto protect the device after a fault.

Effect of Proximity of Permeable and Impermeable Lenses on Well Performance

1964 ◽  
Vol 4 (04) ◽  
pp. 285-290
Author(s):  
Edward P. Miesch ◽  
Paul B. Crawford
Keyword(s):  
Electrical Resistivity ◽  
Steady State ◽  
Production Capacity ◽  
Oil Reservoirs ◽  
Reservoir Rock ◽  
Unsteady State ◽  
Mathematical Study ◽  
Thermal Models ◽  
State Data ◽  
Resistivity Model

Abstract A study was made of the effect of permeable and impermeable lenses in a reservoir on the production capacity of a well. Both steady-state and unsteady-state data were obtained. An electrical resistivity model was used to obtain the steady- state data and thermal models were constructed to obtain the unsteady-state data. The productivity of a well is affected very greatly only when the lenses are close to the well. The effect of circular lenses on the Productivity ratio can be correlated with the distance from the center of the lens to the center of the well divided by the radius of the lens. Then this dimensionless distance is equal to six or greater, the effect of the lenses on production capacity will be negligible. The pseudo steady-state productivity of a heterogeneous reservoir can be predicted using steady- state data. Introduction Many analytical solutions of reservoir behavior assume that reservoir rock is uniform and homogeneous. Although this assumption is used, all of the data from core analyses and well logging indicate that the reservoirs are heterogeneous. Very little work has been done on the performance of heterogeneous reservoirs. The work of Landrum, et al. showed that transient phenomena in oil reservoirs could be studied with thermal models. Pickering and Cotman used thermal models to study flow in stratified reservoirs and investigated the effect of inhomogeneities in oil reservoirs on transient flow performance. Loucks made a mathematical study of the pressure build-up in a system composed of two concentric regions of different permeability. Root, Silberberg and Pirson studied the effect of me growth of the flooded region on water influx predictions using a thermal model consisting of three concentric cylindrical regions of different thermal properties which simulated the aquifer, the flooded region and the unflooded portion of the original hydrocarbon region. Tomme, et al. made a mathematical study of vertical fractures. The object of this investigation was to study the effect of highly permeable and impermeable lenses in the vicinity of the wellbore on the pressure depletion history of the well. Steady- state data were obtained for both conductive and nonconductive lenses that completely penetrated the formation. The lenses were symmetrically located at various distances from the wellbore. The unsteady-state data were obtained on seven thermal models. EXPERIMENTAL EQUIPMENT AND PROCEDURE STEADY-STATE DATA The steady-state data were obtained from an electrical resistivity model 30 in. in diameter and approximately 1 1/2 in. deep. The outside of the model was lined with a 30-in. diameter copper strip, which served as the outer boundary of the reservoir. The bottom was covered with a sheet of plexiglass so that it would be nonconductive. The model was filled with a slightly saline solution. The well size was varied from an 0.064-in. diameter copper wire to a 10-in. diameter copper cylinder. Readings were taken with an impedance bridge using AC current to prevent polarization at the contacts. Copper and wax lenses were used to represent infinitely conductive and nonconductive lenses, respectively. The resistance was first measured for each well diameter with no lenses in the reservoir. Then the conductive and nonconductive lenses were spaced symmetrically at various distances from the well and the resistance read from each lens location. The diameters of the conductive lenses were 3, 1.022 and 0.624 in., and those of the nonconductive lenses were 3, 2.25 and 1.563 in. SPEJ P. 285ˆ

Techniques to Create Compact Thermal Models — Steady State Problems

2014 ◽  
pp. 179-187
Author(s):  
Clemens Lasance ◽  
Mohammed-Nabil Sabry ◽  
Avram Bar-Cohen
Keyword(s):  
Steady State ◽  
Thermal Models

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

2021 ◽  
Author(s):  
Zihao Yuan ◽  
Tao Zhang ◽  
Jeroen Van Duren ◽  
Ayse K. Coskun
Keyword(s):  
Steady State ◽  
Real World ◽  
High Performance ◽  
Silicon Layer ◽  
Maximum Temperature ◽  
Cooling Performance ◽  
Thermal Models ◽  
Heat Spreaders ◽  
Transient Simulations ◽  
Transient Thermal

Abstract Lab-grown diamond heat spreaders are becoming attractive solutions compared to traditional copper heat spreaders due to their high thermal conductivity, the ability to directly bond them on silicon, and allow for an ultra-thin silicon layer. Researchers have developed various thermal models and prototypes of lab-grown diamond heat spreaders to evaluate their cooling performance and heat spreading ability. The majority of existing thermal models are built using finite-element method (FEM) based simulators such as COMSOL and ANSYS. However, such commercial simulators are computationally expensive and lead to long solution times along with large memory requirements. These limitations make commercial simulators unsuitable for evaluating numerous design alternatives or runtime scenarios for real-world high-performance processors. Because of this modeling challenge, none of the existing works have evaluated the thermal behavior of lab-grown diamond heat spreaders on real-world high-performance processors running realistic application benchmarks. Recently, we have developed a parallel compact thermal simulator, PACT, that is able to carry out fast and accurate steady-state and transient thermal simulations and can be extended to support emerging integration and cooling technologies. In this paper, we use PACT to evaluate the steady-state and transient cooling performance of lab-grown diamond heat spreaders against traditional copper heat spreaders on various real-world high-performance processors (e.g., Intel i7 6950X, IBM Power9, and PicoSoC). By using PACT with architectural performance and power simulators such as Sniper and McPAT, we are able to run transient simulations with realistic benchmarks. Simulation results show that lab-grown diamond heat spreaders achieve maximum temperature and thermal gradient reductions of up to 26.73 °C and 13.75 °C when compared to traditional copper heat spreaders, respectively. The maximum steady-state and transient simulation times of PACT for the real-world high-performance chips and realistic applications used in our experiments are 259 s and 22 min, respectively.

Thermal Behavior Evaluation During Mechanical Design: Validation of Thermal Numerical Gearbox Models

2000 ◽  
Author(s):  
Lionel Manin ◽  
Daniel Play
Keyword(s):  
Steady State ◽  
Experimental Validation ◽  
Mechanical Design ◽  
Numerical Models ◽  
Side Wall ◽  
Experimental Results ◽  
Transient Temperature ◽  
Transmitted Power ◽  
Thermal Models ◽  
Thermal Network Method

Abstract In todays mechanical design, static and dynamic numerical models are widely used, and thermal models are needed to make robust design. Thermal models, based on the thermal network method, are now available. Several hypotheses are made as physical phenomena are complex and experimental validation is necessary. A thermal model of gearbox has been already presented and compared to few experimental results that had allowed global validation of the model. Now, the experimental validation is concerned with thermal transient and steady state behavior of gearbox versus transmitted power and lubrication conditions in order to finely validate the model. The test gearbox is compound of 3 spur gears supported by 6 spherical roller bearings, a housing and a lubrication circuit cooled by an oil-air exchanger. The maximum transmitted power is 500 kW. Gears, bearings, housing, shafts, and the lubrication circuit have been equipped with thermocouples, flux-meters and flow-meters. Heat flux were measured on the internal and external side walls of the housing. Oil flowing on a side wall has been measured. Experiments were run under several transmitted powers and oil flows at meshing. Thermal map at steady state and transient temperature rises of technological elements are obtained for each test. Finally, transient temperature rises and steady state from numerical and experimental results are compared. The comparison shows a good agreement, and the importance of taking into account oil flowing on the inside walls of the housing is brought to the fore. The difficulty of evaluating the oil flowing on the internal walls of a housing is discussed and illustrated with numerical results.

scholarly journals Predictions of summertime overheating: Comparison of dynamic thermal models and measurements in synthetically occupied test houses

2019 ◽  
Vol 40 (4) ◽  
pp. 512-552 ◽  
Author(s):  
Ben M Roberts ◽  
David Allinson ◽  
Susie Diamond ◽  
Ben Abel ◽  
Claire Das Bhaumik ◽  
...  
Keyword(s):  
Internal Heat ◽  
Weather Conditions ◽  
Well Being ◽  
Thermal Simulation ◽  
The Other ◽  
Supplementary Information ◽  
Thermal Models ◽  
Door Opening ◽  
Test House ◽  
Health And Well Being

Summertime overheating in UK dwellings is seen as a risk to occupants' health and well-being. Dynamic thermal simulation programs are widely used to assess the overheating risk in new homes, but how accurate are the predictions? Results from two different dynamic thermal simulation programs used by four different experienced modellers are compared with measurements from a pair of traditional, semi-detached test houses. The synthetic occupancy in the test houses replicated curtain operation and the CIBSE TM59 internal heat gain profiles and internal door opening profiles. In one house, the windows were always closed and in the other they operated following the TM59 protocol. Sensors monitored the internal temperatures in five rooms and the local weather during a 21-day period in the summer of 2017. Model evaluation took place in two phases: blind and open. In the blind phase, modellers received information about the houses, the occupancy profiles and the weather conditions. In the open phase, modellers received the test house temperature measurements and, with the other modellers, adjusted their models to try and improve predictions. The data provided to modellers is openly available as supplementary information to this paper. In both phases, during warm weather, the models consistently predicted higher peak temperatures and larger diurnal swings than were measured. The models' predicted hours of overheating were compared with the measured hours using the CIBSE static threshold of 26℃ for bedrooms and the BSEN15251 Category II threshold for living rooms. The models developed in each phase were also used to predict the annual hours of overheating using the CIBSE TM59 procedure. The inter-model variation was quantified as the Simulation Resolution. For these houses, the blind phase models produced Simulation Resolution values of approximately 3% ± 3 percentage points for TM59 Criterion A and 1% ± 1 percentage point for TM59 Criterion B. The Simulation Resolution concept offers a valuable aid to modellers when assessing the compliance of dwellings with the TM59 overheating criteria. Further work to produce Simulation Resolution values for different dwelling archetypes and weather conditions is recommended. Practical application: Overheating in UK homes is a serious and growing risk to health and well-being. Dynamic thermal models are used to predict overheating risk in existing and proposed dwellings. Comparisons between predicted temperatures and temperatures measured in two test houses shed light on the accuracy of predictions for existing homes. CIBSE Technical Memorandum TM59 provides a strategy for predicting overheating risk in proposed dwellings. There are, however, differences between models' predictions. The concept of Simulation Resolution is introduced to quantify this inter-model variability. It provides modellers with a firm basis on which to determine whether TM59 overheating predictions are robust.

A critical review of thermal models for electro-thermal simulation

2002 ◽  
Vol 46 (4) ◽  
pp. 487-496 ◽  
Author(s):  
V. d'Alessandro ◽  
N. Rinaldi
Keyword(s):  
Critical Review ◽  
Thermal Simulation ◽  
Thermal Models

Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs

2004 ◽  
Vol 44 (3) ◽  
pp. 381-396 ◽  
Author(s):  
Ming-C. Cheng ◽  
Feixia Yu ◽  
Lin Jun ◽  
Min Shen ◽  
Goodarz Ahmadi
Keyword(s):  
Steady State ◽  
Heat Flow ◽  
Flow Analysis ◽  
Silicon On Insulator ◽  
Thermal Models

Thermal Simulation Benchmark of Graphic Module Under Installed, Operating Conditions

2005 ◽  
Author(s):  
Fariborz Forghan ◽  
Gregory J. Kowalski ◽  
Mansour Zenouzi ◽  
Hameed Metghalchi
Keyword(s):  
Steady State ◽  
Computer Games ◽  
Electronic Device ◽  
Thermal Response ◽  
Thermal Simulation ◽  
Operating Conditions ◽  
Maximum Temperature ◽  
Software Environment ◽  
Transient Thermal ◽  
Graphic Module

The thermal performance of a graphic module on graphic card is theoretically and experimentally investigated. Unlike prior benchmark studies, this study involves a practical electronic device operating in a real software environment. The temperatures at five locations on the module and at one point on the board are measured as a function of time during the operation of a series of computer games. The theoretical model is developed using Flotherm to simulate the transient thermal response. There is close agreement from 3% to 10% between the numerical steady state case prediction and test data. The calculated transient trends using Flotherm model closely agree with experimental results and demonstrate the rapid increase in temperature as the number of module operations increases during the games. The results for the maximum temperature are directly linked to the software operation and exhibit a superposition type behavior in which the observed maximum operating temperature can exceed that estimated by steady state conditions. As expected, the results demonstrate that a carefully constructed thermal simulation can accurately predict the thermal response of a module under actual operating conditions.

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